标签: considerations

TestConsiderationsforPLDs(ti)

POWERCONSIDERATIONSINFPGADESIGN(lattice)

ConsiderationsonSet-PointWeightchoicefor2-DoFPIDControllers

DN05025-D_ONSEMI_MOSFETPre‐driverPWMConsiderations.PDF

Abstract:Thisarticlediscussestherequirementsanddesignconsiderationsforautomotiveapplications,includingthoseforenginecontrol,infotainment,andbodyelectronics.ItalsodiscussesseveralMaximdevicesthatareidealforautomotivepowerapplications.Maxim>DesignSupport>TechnicalDocuments>ApplicationNotes>Automotive>APP5346Maxim>DesignSupport>TechnicalDocuments>ApplicationNotes>Power-SupplyCircuits>APP5346Keywords:automotive,powercontrol,infotainment,bodyelectronics,enginecontrol,powertrain,ISO9000,TS16949Apr02,2012APPLICATIONNOTE5346PowerControlforAutomotiveApplicationsBy:MasayukiNakagawaApr02,2012Abstract:Thisarticlediscussestherequirementsanddesignconsiderationsforautomotiveapplications,includingthoseforenginecontrol,infotainment,andbodyelectronics.ItalsodiscussesseveralMaximdevicesthatareidealforautomotivepowerapplica……

【应用手册】AN596:ModelingandDesignConsiderationsfor10GbpsConnectorsThisapplicationnotediscussestheimpactofbackplaneconnectorsona10Gbpsserialchannelperformance.Itdemonstrateshowtoprojecttheconnector’simpactatthesystemlevelwiththehelpofanindustrialsimulationsoftware.Designconsiderationsofthebackplaneconnectorandpinfieldarediscussedtominimizetheconnector’simpactandtomeetthechannel’ssignalintegrityrequirement.Simulationandmeasurementresultsareshowntodemonstratetheeffectivenessofthedesignconsiderations.AN596:ModelingandDesignConsiderationsfor10GbpsConnectorsMarch2010AN-596-1.0Thisapplicationnotediscussestheimpactofbackplaneconnectorsona10Gbpsserialchannelperformance.Itdemonstrateshowtoprojecttheconnector’simpactatthesystemlevelwiththehelpofanindustrialsimulationsoftware.Designconsiderationsofthebackplaneconnectorandpinfieldarediscussedtominimizetheconnector’simpactandtomeetthecha……

【应用笔记】StratixII器件系统功耗考虑(StratixIIDeviceSystemPowerConsiderations)Altera采用90nm制程技术开发了StratixII器件，这项技术可以优化性能和电源。但伴随着90nm器件的引入，新的挑战产生了。AlteradevelopedStratix?IIdevicesusinga90-nmprocesstechnologyoptimizedforperformanceandpower.Newchallengesaccompanytheintroductionof90-nmdevices.InadditiontotheusualcorepowerandI/Opower,90-nmdevicesdissipatealargerleakagepowercomparedwithpreviousprocesstechnologydevices.Thisleakagepowercanbeasignificantcontributortodevicepowerdissipation.Toavoidexcessivepowerleakage,StratixIIdevicesuselowleakagetransistortechnologywhereverpossibletoreducepowerlossduetostandbycurrent.Thisapplicationnoteaddressestheseitemsalongwithacomprehensivepowermanagementstrategy.StratixIIDeviceSystemPowerConsiderationsJune2004,ver.1.0ApplicationNote355IntroductionAlteradevelopedStratixIIdevicesusinga90-nmprocesstechnologyoptimizedforperformanceandpower.Newchallengesaccompanytheintroductionof90-nmdevices.InadditiontotheusualcorepowerandI/Opower,90-nmdevicesdissipatealargerleakagepowercomparedwithpreviousprocesstechnologydevices.Thisleakagepowercanbeasignificantcontributortodevicepowerdissipation.Toavoidexc……

EMCDesignConsiderationsforPCBLayoutEMCDesignConsiderationsforPCBLayoutHarryW.Gaul,P.E.EMC/TEMPESTGroupGeneralDynamicsDecisionSystemsHarry.Gaul@gdds.comGeneralDynamicsDecisionSystemsCOPYRIGHT2003GENERALDYNAMICSALLRIGHTSRESERVED1WhyWorryAboutPCBLayout?SignalQuality-Overshoot/undershoot/ringingofsignalandclockedgesSelf-compatibilityandS/Nperformance-InductiveandcapacitivecrosstalkLegalrequirementsforregulatorycompliance-Emissions,immunity,ESDDO-160andMIL-STD-461contractualrequirementsGeneralDynamicsDecisionSystemsCOPYRIGHT2003GENERALDYNAMICSALLRIGHTSRESERVED21ThisdevicecomplieswithPart15,SubpartB,ClassBoftheFCCRules.Operationissubjecttothefollowingtwoconditions:(1)thisdevicemaynotcauseharmfulinterfere……

EMCDesignConsiderationsAVR040:EMCDesignConsiderationsScopeThisapplicationnotecoversthemostcommonEMCproblemsdesignersencounterwhenusingmicrocontrollers.Itwillbrieflydiscussthevariousphenomena.ThereferenceliteraturecoversEMCdesigninmoredetail,andfordesignerswhoaregoingtobuildproductsthatneedtobeEMCcompliant,furtherstudyishighlyrecommended.AgoodEMCdesignrequiresmoreknowledgethanwhatcanbeputintoashortapplicationnote.Unlikemanyotherdesignissues,EMCisnotanareawhereitispossibletolistasetofrules.EMCcompliancecannotbeguaranteedbydesign;ithastobetested.ItisrecommendedthatreadersunfamiliarwithEMCdesignreadthisdocumentmorethanonce,assomeofthesubjectsdescribedearlyinthisdocumentaremoreeasilyunde……

ATC_ConsiderationsforOptimalCapacitiveCoupling……

SignalIntegrityConsiderationsForHighSpeedDigitalHardwareDesign-MickGrant-2002SignalIntegrityConsiderationsforHighSpeedDigitalHardwareDesignWhitePaperIssue:01,11thNovember2002MickGrant,DesignEngineerAbstractAssystemclockfrequenciesandrisetimesincrease,signalintegritydesignconsiderationsarebecomingevermoreimportant.UnfortunatelymanyDigitalDesignersmaynotrecognisetheimportanceofsignalintegrityissuesandproblemsmaynotbeidentifieduntilitistoolate.Thispaperpresentsthemostcommondesignissuesaffectingsignalintegrityinhigh-speeddigitalhardwaredesign.Theseincludeimpedancecontrol,terminations,ground/powerplanes,signalroutingandcrosstalk.Armedwiththeknowledgepresentedhere,adigitaldesignerwillbeabletorecognisepotentialsignalintegrityproblemsattheearliestdesignstage.Als……

一篇DDR相关设计的资料,DDR_considerations……

AntennaDesignConsiderationstelecontrolliAntennaDesignConsiderationsIntroduction:InLowPowerWirelessSystems,goodAntennadesignisrequiredtorealizegoodrangeperformance.Withoutanantennaitisimpossibletotransmitdataoveralongdistancerange.Undeniably,ofalltheelementsinawirelesssystems,theAntennaisthemostdifficulttodesignandoptimize.Inaddition,anantenna’sperformanceiscloselydependentonvariablessuchasthedielectricconstants,proximitytoothercomponents,andmaterialsproperties.Finally,antennameasurementandcharacterizationrequiressophisticatedandexpensivetestequipment,whichmaynotbereadilyavailable.ThisApplicationNoteillustratethemostpopularantenna’stypeutilizedinLowPowerWirelessSystems,andshouldhelptoachieveeffectiveantenn……

APNT3004-JammingConsiderations(Rev1ThisdocumentbecomesanUNCONTROLLEDCOPYonceprintedfromSiRF’sIntranet.Toreceiveacontrolledcopy,pleasecontactDocumentControl.ApplicationNote:Co-LocationandJammingConsiderationsforSSIIIIntegrationDocumentNo:APNT3004Revision112/13/04Author:S.FeekoPROPRIETARYNOTEThisdocumentcontainsproprietaryinformationtoSiRFTechnology,Inc.andshallnotbereproducedortransferredtootherdocumentsordisclosedtoothersorusedforanypurposeotherthanthatforwhichitwasobtainedwithoutexpressedwrittenconsentofSiRFTechnology,Inc.SiRFTechnology,Inc.ProprietaryandConfidentialPageiApplicationNote:Co-LocationandJammingConsiderationsforSSIIIIntegrationThisdocumentbecomesanUNCONTROLLEDCOPYonceprintedfromSiRF’sIntranet.T……

SignalIntegrityandPCBlayoutconsiderationsforDDR2-800MbsandDDR3MemoriesSignalIntegrityandPCBlayoutconsiderationsforDDR2-800Mb/sandDDR3MemoriesFidusSystemsInc.900,MorrisonDrive,Ottawa,Ontario,K2H8K7,CanadaChrisBrennan,CristianTudor,EricSchroeter,HeikeWunschmann,andSyedBokhariSession#8.13AbstractThepaperaddressesthechallengeofmeetingSignalIntegrity(SI)andPowerIntegrity(PI)requirementsofPrintedCircuitBoards(PCBs)containingDoubleDataRate2(DDR2)memories.TheemphasisisonlowlayercountPCBs,typically4-6layersusingconventionaltechnology.Somedesignguidelineshavebeenprovided.1.IntroductionDDR2usageiscommontodaywithapushtowardshigherspeedssuchas800Mbps[1]andmorerecently,1066Mbps.DDR3[2]targetsadatarateof1600Mbps.FromaPCBimplementationstandpoint,apri……