tag 标签: j-lead

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  • 所需E币: 4
    时间: 2019-12-24 20:38
    大小: 730.29KB
    上传者: 二不过三
    【应用手册】GuidelinesforHandlingJ-Lead,QFP,BGA,FBGA,andLidlessFBGADevicesThisapplicationnoteprovidesguidelinesforhandlingJ-Lead,QuadFlatPack(QFP),andBall-GridArray(BGA,includingFineLineBGA[FBGA]andlidlessFBGApackaging)devicestopreservethequalityofthesedevicesduringstorage,shipment,andtransferandtoensureeasiersoldering.Devicesthatusesurface-mountJ-Lead,QFP,BGA,FBGA,andlidlessBGAarenowcommononboardsbecausetheyprovidedensity,size,andcostbenefits.However,afewprecautionsarenecessarytoprotectthesedevicesfrommechanicaldamageduringtransportationandstorage.GuidelinesforHandlingJ-Lead,QFP,BGA,FBGA,andLidlessFBGADevicesAN-071-5.0ApplicationNoteThisapplicationnoteprovidesguidelinesforhandlingJ-Lead,QuadFlatPack(QFP),andBall-GridArray(BGA,includingFineLineBGA[FBGA]andlidlessFBGApackaging)devicestopreservethequalityofthesedevicesduringstorage,shipment,andtransferandtoensureeasiersoldering.……