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时间: 2019-12-24 23:22
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有关热特性的包装半导体器ThermalCharacterizationofPackagedSemiconductorDevicesTechnicalBriefDecember2002TB379.3Author:JimBensonIntroductionTheterm"psi"isusedtodistinguishthesefrom"theta"thermalresistancessincenotallheatisactuallyflowingWiththec……
标签: 半导体器
