所需E币: 4
时间: 2019-12-28 19:30
大小: 828.78KB
【技术应用笔记】引脚架构芯片级封装(LFCSP)设计与制造指南(LFCSP)ǖGaryGriffin...................................................................................................1(LFCSP)...................................................................................................1LFCSPJEDECMO220MO229......................................................................................2...........................................................................................5..............................……