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High-Performance FPGA PLL Analysis with TimeQuest

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High-PerformanceFPGAPLLAnalysiswithTimeQuest……
大家觉得PCB或ICP 埋入被动元件技术发展如何

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perfromanceElectricalPerformanceAdvantagesofUltra-ThinDielectricMaterialsUsedforPower-GroundCoresinHighSpeed,MultilayerPrintedCircuitBoardsJoelPeiffer3MCompanySt.Paul,MNBobGreenleeMerixCorporationForestGrove,ORIstvanNovakSunMicrosystemsBurlington,MAIntroductionThinlayers(50um)ofFR-4materialhavebeenusedforpower-groundcoresforanumberofyearstoimproveelectricalperformance.Thesethinpower-groundcoresserveasdistributedcapacitorlayerstoassistinpowersupplydecoupling.However,withtheever-increasingspeedsofcircuitsandthetrendtolowervoltagesandhigherswitchingspeeds,thesethinlayersnolongerprovidetherequiredelectricalproperties(lowimpedance,highcapacitance)necessaryfornextgeneration,highspeeddigitalcir……

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