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时间: 2020-1-14 10:00
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GSMDual-BandPAMICRAVEJOUOWREVIEWEDTECHNICALFEATUREITORIALBORADALRNEDAHIGHEFFICIENCY,LOWCOSTSILICONBIPOLARGSMDUAL-BANDPAMODULEAsthewirelesscommunicationbusinesscontinuestoexpand,thereisgreatdemandforreducingthecostofallpartsofthesystems,andtousesemiconductormanufacturingprocessesandcomponenttechniquesthatcanhandleveryhighvolumeproductionduringtheshortproductcyclesofmanyofthenewdevices.Foralongtime,thetransceiverblocksinmobilephoneshavebeendesignedpreferablyinbipolarsilicontechnology(RFIC),orBiCMOSifmorecomplexity(integrationlevel)isneeded.However,fortheoutputpoweramplifier(PA),III-Vbasedsemiconductordevicesarestilldominating,eitherasdiscretedevices,moderatelyintegrat……