http://www.lingmei.com.cn/procenter-bga.htm
产品特点:
Any package style: ceramic & plastic BGA, CSP, LGA, CGA, PSGA, MLF/QFN,QFP, SOIC, and other standard packages, custom packages or bare die Inductance: less than 2nH -1dB bandwidth: >14GHz for compression style; 3GHz for SMD style available for any chip size and grid pattern Same PCB layout as the IC (no holes required for SMD socket) Minimal keepout area of 6mm beyond the IC’s periphery Raised SMD style for lifting socket over adjacent components Low profile socket (standard Twist Lock is less than 10mm high with IC) Contact force: max 40 grams per contact; lower forces available Semi-custom design = lower cost and tailored to your needs
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第三代功率半导体器件测试解决方案 直播时间： 03月06日 10:00
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