Service scope:
●IC function Test and Evaluation Engineering
●Destructive Physical Analysis(DPA)
●High/ Low Temperature and Humidity Test
●Thermal Shock Test
●IC Weatherometer Analysis
●IC Life Cycle Testing
●IC Durability, Reliability Testing, Burn in test.
●Make the Fixture to the IC tester, and IC Test Program Development Service
●Sample Die Package and Bonding
●Chemical Decapsulation Process and Dyeing Marking, take the IC Layout Photo
●ESD and Latch-up Testing
●FIB (Focused Ion Beam) maintain the microcircuit in chip
●WEEE /RoHS(Lead-Free) Test and Analysis
Value Added Services:
● General IC & Discontinued IC Replacements Solutions
● Electronic components qualisty disputes coordinations.
● CECC ESCROW services
We sincerely wish to be your strategic partner in IC fields for your developing business in Asia even globally.
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