原创 功率电子元器件冷却方式比较

目前电动车或混动车中功率元器件（如inverter, DC-DC converter）设计中比较棘手的问题是电子元器件的冷却问题。电子元器件设计都会有最大允许温度，而其影响因素非常复杂，材料、结构、冷却温度影响最终的设计能否达到目标。看了一篇关于功率电子元器件，虽然研究不是非常深入，但还是通过三种不同PACKAGE方式（BL, DBSC, IHS）比较系统的探讨了冷却剂温度、可冷却的表面数（单边冷却还是双边冷却）、有效热传导系数、最大半导体结温、界面热阻系数的影响。在假定目标Heat Dissipation为200W/cm²条件下，论证了各种参数的最低要求和实现的可能性并指出了双面冷却方式的研究必要性。对我们设计功率电子元件有一定的参考意义。

Abstract—This study quantifies the heat dissipation potential of three inverter package configurations over a range of control factors. These factors include coolant temperature, number of sides available for cooling, effective heat transfer coefficient, maximum semiconductor junction temperature, and interface material thermal resistance. Heat dissipation potentials are examined in contrast to a research goal to use 105℃ coolant and dissipate 200 W/cm2 heat across the insulated gate bipolar transistor and diode silicon area. Advanced double-sided cooling configurations with aggressive heat transfer coefficients show the possibility of meeting these targets for a 125℃ maximum junction temperature, but further investigation is needed. Even with maximum tolerable junction temperatures of 200℃, effective heat transfer coefficients of 5,000 to 10,000 W/m2-K will be needed for coolant temperatures of 105℃ or higher.

Index Terms—Inverters, Cooling, Semiconductor Device Thermal Management, Semiconductor Device Thermal Control

attachment download