标签: guideline

IPC-7352_2023GenericGuidelineforLandPatternDesign连接盘图形设计通用指南

TheGuidelineofInvestmentProjectFeas....pdf

VICOR_PCBMountVIASolderingGuideline

NetbookSchematicguidelinereduceEMCSchematicguidelinereduceEMCSchematicguidelineClock:1.AllclocktracesaddRCfilteronthesourceside,andiftheclockdrivetwochipset(orabove)referthefollowingcircuit.所有时钟线要作源端RC匹配，如果时钟输出有两个或多个负载，参考下列电路图.2.Useπ(C-L-C)typeoffilterforOscillators’powersupplyinput.在晶振的电源输入端加π型滤波.3.IftheICclockoutputpinsarenotused,webestcloseitbythroughsoftware.AddRorCbypasstoGNDasterminalifwecan’tcloseitbysoftware如果有芯片的时钟输出脚没有用到，首先看能否用软件关掉该脚的输出，如果不行，在时钟脚加R或C到地4.Suggestdon’tlayanothertracejustfortheclocktestpoint.时钟线上不要加测试点5.Suggestaddingdampingresistorsonthehighspeedsignaltracesorreserve0ohmresistance.建议在所有高速信号线上串阻尼电阻,或者预留0ohm电阻.Power:1.Thebulkcapacitorswhichu……

designguidelineforQFN(QualFlatnonlead)JEDECDESIGNSTANDARDDESIGNREQUIREMENTSFOROUTLINESOFSOLIDSTATEANDRELATEDPRODUCTSJEDECPUBLICATION95DESIGNGUIDE4.19QUADNO-LEADSTAGGEREDANDINLINEMULTI-ROWPACKAGES(WITHOPTIONALTHERMALENHANCEMENTS)(QFN)JEDECSOLIDSTATETECHNOLOGYASSOCIATIONDate:May2007Issue:DItem:11.2-765(s)JEDECPublication95Page4.19-1/DPLASTICQUADNO-LEADSTAGGE……

infineonc16x系列电磁兼容性设计ApplicationNote,V3.3,October2006AP24026MicrocontrollerEMCDesignGuidelinesforMicrocontrollerBoardLayoutMicrocontrollersNeverstopthinking.Edition2006-10PublishedbyInfineonTechnologiesAG81726München,GermanyInfineonTechnologiesAG2006.AllRightsReserved.LEGALDISCLAIMERTHEINFORMATIONGIVENINTHISAPPLICATIONNOTEISGIVENASAHINTFORTHEIMPLEMENTATIONOFTHEINFINEONTECHNOLOGIESCOMPONENTONLYANDSHALLNOTBEREGARDEDASANYDESCRIPTIONORWARRANTYOFACERTAINFUNCTIONALITY,CONDITIONORQUALITYOFTHEINFINEONTECHNOLOGIESCOMPONENT.THERECIPIENTOFTHISAPPLICATIONNOTEMUSTVERIFYANYF……

Layoutguideline|連板設計制程要求部分:||1）当基板四周元件距離板邊大於4mm時，不需要加工作邊。因工廠機器傳輸帶鏈爪直徑為4m||m.||2）当基板四周元件距離板邊小於4mm時,要求工作边，一般情況是和connector平行的边為工||作板邊。其工作邊宽为(5~8mm)+-0.5。但有時PCB分布別特，根據實際來定。||3)当板上没有光學点时，因機器需要識別每個元件的坐標，所以一定在工作邊上加光學点||。（左上右下二点，标准请参考图案）。||4)当要求有AI制程时，要有AIHole孔。距離AI元件要有8mm.||距離工作板邊要有5mm（左上右下二点，标准请参考图案）。||5）根據SMT機器CP吸嘴范圍為50*50~457*356mm且傳送帶寬有250mm的規格，所以它們的長寬||決定了連片板長寬要求：L*W=(50*50~350*250)*1.6mm或(50*50~300*200)*0.8mm||6)在決定連板數量時，要綜合經濟尺寸和制程要求。||……

PCBDesignGuidelinePCBDesignGuidelinesForReducedEMISZZA009November19991IMPORTANTNOTICETexasInstrumentsanditssubsidiaries(TI)reservetherighttomakechangestotheirproductsortodiscontinueanyproductorservicewithoutnotice,andadvisecustomerstoobtainthelatestversionofrelevantinformationtoverify,beforeplacingorders,thatinformationbeingreliedoniscurrentandcomplete.Allproductsaresoldsubjecttothetermsandconditionsofsalesuppliedatthetimeoforderacknowledgement,includingthosepertainingtowarranty,patentinfringement,andlimitationofliability.TIwarrantsperformanceofitssemiconductorproductstothespecificationsapplicableatthetimeofsaleinaccordancewithTI’sstandardwarranty.Testingandotherqualitycontroltechniques……

safetydesignguidelinesafetydesignguideline©CommonwealthofAustralia2005ISBNtobesuppliedThisworkiscopyright.Youmaydownload,display,printandreproducethismaterialinunalteredformonly(retainingthisnotice)foryourpersonal,non-commercialuseorusewithinyourorganisation.ApartfromanyuseaspermittedundertheCopyrightAct1968,allotherrightsarereserved.RequestsforfurtherauthorisationshouldbedirectedtotheCommonwealthCopyrightAdministration,IntellectualPropertyBranch,DepartmentofCommunications,InformationTechnologyandtheArts,GPOBox2154,CanberraACT2601orbyemailto:mailto:commonwealth.copyright@dcita.gov.auTheAustralianSafetyandCompensationCouncil(ASCC),formerlytheNationalOccupationalHealthandSafetyCommission(NOHSC),leadsand……

HighSpeedUSBPlatformDesignGuideline---IntelHighSpeedUSBPlatformDesignGuidelinesRev.1.0HighSpeedUSBPlatformDesignGuidelinesREVISIONHISTORYRevision0.9RevisionHistoryPreliminaryrelease.Date07/12/2000"THISSPECIFICATION[DOCUMENT]ISPROVIDED"ASIS"WITHNOWARRANTIESWHATSOEVER,INCLUDINGANYWARRANTYOFMERCHANTABILITY,NONINFRINGEMENT,FITNESSFORANYPARTICULARPURPOSE,ORANYWARRANTYOTHERWISEARISINGOUTOFANYPROPOSAL,SPECIFICATIONORSAMPLE.Inteldisclaimsallliability,includingliabilityforinfringementofanyproprietaryrights,relatingtouseofinformationinthisspecification.Nolicense,expressorimplied,byestoppelorotherwise,toanyintellectualpropertyrightsisgrantedherein.Intelassumesnoresponsibilityforanyerrors,whichmayappearinthisdocument.Intelmakesn……

RFDESIGNGuideline……

070806_NeoPAC_Guideline_ver01(cn)NeoPAC使用指南Ver.0.1OptoPACInc.WorldStandardPhotoSensorPackage1目录NeoPAC结构分析NeoPACSealingRing构造使用NeoPAC注意事项清洗方法指南Rework指南NSMD板设计指南SMT指南Reflow曲线图WorldStandardPhotoSensorPackage2NeoPAC结构分析A1’AA1P产品关键特征/注释:玻璃(0.5mm)基板背面研磨(Backgrinding)7.0mils(178m)锡球直径=0.35mm描述Die厚度(P)玻璃基板厚度(A1’)锡球高度,reflow后(A1)Package总高度(A=A1+A1’)NeoPACMin0.1650.4500.2450.724Max0.1910.5500.3450.866平均值0.1780.5000.2950.795WorldStandardPhotoSensorPackage3NeoPACSealingRing的构造NeoPAC有带airvent的sealing构造.AirventNeoPACAir造已经注册了OptoPAC的专利..NeoPAC的的AirVentVent构构造已经注册了OptoPAC的专利WorldStandardPhotoSensorPackage4使用NeoPAC时注意事项1.清洗方法92.要除去SMT作业时所产生的微尘和flux残渣或SMT后……

GaAs_mmic_reliability_assurance_guidelineJPLPublication96-25GaAsMMICReliabilityAssuranceGuidelineforSpaceApplicationsSammyKayaliJetPropulsionLaboratoryGeorgePonchakNASALewisResearchCenterRolandShawShasonMicrowaveCorporationEditorsDecember15,1996NationalAeronauticsandSpaceAdministrationJetPropulsionLaboratoryCaliforniaInstituteofTechnologyPasadena,CaliforniaTheresearchdescribedinthispublicationwascarriedoutbytheJetPropulsionLaboratory,CaliforniaInstituteofTechnology,underacontractwiththeNationalAeronauticsandSpaceAdministration.Referencehereintoanyspecificcommercialproduct,process,orservicebytradename,trademark,manufacturer,orotherwise,doesnotconstituteorimplyitsendorsementbytheUnitedStatesGovernmentortheJetPropulsionLaborato……

pcbemcdesignguidelineMicrocontrollerBoardLayoutApplicationNote,V3.0,April2005AP24026MicrocontrollerEMCDesignGuidelinesMicrocontrollerBoardLayoutforMicrocontrollersNeverstopthinking.TriCoreRevisionHistory:2005-04PreviousVersion:2001-04PageSubjects(majorchangessincelastrevision)allGeneralupdateV3.0ControllerAreaNetwork(CAN):LicenseofRobertBoschGmbHWeListentoYourCommentsAnyinformationwithinthisdocumentthatyoufeeliswrong,unclearormissingatall?Yourfeedbackwillhelpustocontinuouslyimprovethequalityofthisdocument.Pleasesendyourproposal(includingareferencetothisdocument)to:mcdocu.comments@infineon.comAP24026EMCDesignGuidelinesTableofContentsTableofContents11.11.2233.13.1.13.1.1.13.1.1.23.1.23……

High-SpeedBoardLayoutGuidelines……