所需E币: 4
时间: 2019-12-24 20:38
大小: 730.29KB
【应用手册】GuidelinesforHandlingJ-Lead,QFP,BGA,FBGA,andLidlessFBGADevicesThisapplicationnoteprovidesguidelinesforhandlingJ-Lead,QuadFlatPack(QFP),andBall-GridArray(BGA,includingFineLineBGA[FBGA]andlidlessFBGApackaging)devicestopreservethequalityofthesedevicesduringstorage,shipment,andtransferandtoensureeasiersoldering.Devicesthatusesurface-mountJ-Lead,QFP,BGA,FBGA,andlidlessBGAarenowcommononboardsbecausetheyprovidedensity,size,andcostbenefits.However,afewprecautionsarenecessarytoprotectthesedevicesfrommechanicaldamageduringtransportationandstorage.GuidelinesforHandlingJ-Lead,QFP,BGA,FBGA,andLidlessFBGADevicesAN-071-5.0ApplicationNoteThisapplicationnoteprovidesguidelinesforhandlingJ-Lead,QuadFlatPack(QFP),andBall-GridArray(BGA,includingFineLineBGA[FBGA]andlidlessFBGApackaging)devicestopreservethequalityofthesedevicesduringstorage,shipment,andtransferandtoensureeasiersoldering.……