标签: flip-chip

Drivenbythetrendtosmaller,lighter,andthinnerconsumerproducts,smallerpackagetypeshavebeendeveloped.Indeed,packaginghasbecomeakeydeterminantforusingorabandoningadeviceinanewdesign.Thisarticlefirstdefinestheterms"flipchip"and"chip-scalepackage"andexplainsthetechnicaldevelopmentofwafer-levelpackaging(WLP)technology.Nextitdiscussespracticalaspectsofusingwafer-levelpackageddevices.Topicsinthatdiscussioninclude:determiningtheavailabilityofflip-chip/UCSP™packagingforagivendevice;identifyingaflipchip/UCSPbyitsmarking;thereliabilityofwafer-levelpackagedparts;andfindingapplicablereliabilityinformation.Thedocumentconcludeswithanoutlookonfuturepackagingdevelopments,referencestodocumentsusedinwritingthisapplicationnote,andlinkstoadditionalliteraturethataddressestopicsnotdiscussedhere.……