标签: 对照

PCB用基材词汇中英文对照PCB123456789basemateriallaminateЁ+10111213141516171819202122232425262728293031323334353637383940414243888compositelaminatethinlaminatebasismaterialprepregbondingsheetepoxyglasssubstratecorematerialbondinglayerfilmadhesivecoverlayer(coverlay)stiffenermaterialcopper-cladsurfacefoilremovalsurfaceuncladlaminatesurfacebasefilmsurfaceadhesivefaecplatefinishmattfinishlengthwisedirectioncross……

PCB术语中英对照一、综合词汇1、印制电路：printedcircuit2、印制线路：printedwiring3、印制板：printedboard4、印制板电路：printedcircuitboard(pcb)5、印制线路板：printedwiringboard(pwb)6、印制元件：printedcomponent7、印制接点：printedcontact8、印制板装配：printedboardassembly9、板：board10、单面印制板：single-sidedprintedboard(ssb)11、双面印制板：double-sidedprintedboard(dsb)12、多层印制板：mulitlayerprintedboard(mlb)13、多层印制电路板：mulitlayerprintedcircuitboard14、多层印制线路板：mulitlayerpritedwiringboard15、刚性印制板：rigidprintedboard16、刚性单面印制板：rigidsingle-sidedprintedborad17、刚性双面印制板：rigiddouble-sidedprintedborad18、刚性多层印制板：rigidmultilayerprintedboard19、挠性多层印制板：flexiblemultilayerprintedboard20、挠性印制板：flexibleprintedboard21、挠性单面印制板：flexiblesingle-sidedprintedboard22、挠性双面印制板：flexibledouble-sidedprintedboard23、挠性印制……

EN55024测试项目对照表IEC/EN55024测试项目对照表测试项目ESDPFMFRS测试端口测试规格Basic.StandardPerformance.CriteriaBAA±4kVContactdischargeIEC61000-4-2±8kVAirDischargeEnclosurePort50Hz1A/m(r.m.s.)IEC61000-4-880-1000MHzIEC61000-4-380%AM(1kHz)3V/m(un-modulated,r.m.s.)SignalTele.Port1kV(peak)forLinetoGround1.2/50(8/20)Tr/ThusDCPort0.5kVforLinetoGround1.2/50(8/20)Tr/ThusIEC61000-4-51.2/50(8/20)Tr/Thus1kV(peak)forLinetoLine2kV(peak)forLinetoGroundSurgeACPortBSignalTele.Port0.5kV(peak)/5kHz5/50Tr/ThnsDCPortEFTACPort0.5kV(peak)/5kHz5/50Tr/Thns1kV(peak)/5kHz5/50Tr/ThnsIEC61000-4-4BSignalTele.Port0.15-80MHz80%AM(1kHz)3V(un-modulated,r.m.s.)DCPortCSACPort0.15-80MHzIEC61000-4-680%AM(1kHz)3V(un-modulated,r.m……

射频术语对照表第一课射频术语AAccessControl访问控制ActiveRFIDSystem主动射频系统用自身的射频能量主动地发送数据给读写器ActiveTag有源标签,或称为主动标签AgileReader灵敏解读器AIM自动识别技术协会Amplitude振幅AnalogData模拟数据Antenna天线Anti-collision防冲突ApplicationIntegration应用集成ApplicationProgrammingInterface(API)应用程序接口AssetManagement资产管理AssetTracking资产跟踪Audit核查Automaticdatacapture(ADC)自动数据获取AutomaticIdentification(Auto-ID)自动识别AutomaticIdentificationandDataCollection(AIDC)自动识别和数据采集BBackScatter反射散布Barcode条形码BillofLading提货单Bit位Bluetooth蓝牙技术BusinessProcess业务流程CCache缓存Carrier载体CarrierSignal载波讯号CheckDigit校验位Chip芯片ChiplessTag无芯标签Collision冲突Concatenation链接ContactlessSmartCard无接触智能卡Container集装箱ControlModule控制模块Coupling耦合DDataCarrier数据载体DataCollection数据采集DataEntry数据输入……

电压功率对照表dbm-volts-wattsconversiondBm-volts-wattsconversion(50-ohmsystem)dBm+53+50+49+48+47+46+45+44+43+42+41+40+39+38+37+36+35+34+33+32+31+30+29+28+27+26+25+24+23+22+21+20+19+18+17+16+15+14+13+12+11+10+9+8+7+6+5+4+3+2+1V100.070.764.058.050.044.540.032.532.028.026.222.520.018.016.014.112.511.510.09.08.07.106.405.805.004.454.003.553.202.802.522.252.001.801.601.411.251.151.00.90.80.71.64.58.500.445.400.355.320.280.252Po200W100W80W64W50W40W32W25W20W16W12.5W10W8W6.4W5W4W3.2W2.5W2W1.6W1.25W1.0W800mW640mW500mW400mW320mW250mW200mW160mW125mW100mW80mW64mW50mW40mW32mW25mW20mW16mW12.5mW10mW8mW6.4mW5mW4mW3.2mW2.5mW2.0mW1.6mW1.25mWdBm0-1-2-3……

美制电线标准AWG与公制、英制单位对照美制电线标准AWG与公制、英制单位对照在以太网和xDSL接入网设计中，经常会碰到诸如24AWG、26AWG等等表示电缆直径的方法。其实AWG(AmericanWireGauge)是美制电线标准的简称，AWG值是导线厚度（以英寸计）的函数。下表是AWG与公制、英制单位的对照表。其中，4/0表示0000，3/0表示000，2/0表示00，1/0表示0。例如，常用的电话线直径为26AWG，约为0.4mm。外径AWG公制mm4/011.68英制inch0.46截面积电阻值(mm2)(Ω/km)107.220.170.210.260.330.420.530.660.841.061.331.682.112.673.364.245.316.698.4510.613.516.3外径AWG公制mm22232425262728293031323334353637383940414243444546英制inch截面积电阻值(mm2)(Ω/km)0.6430.02530.324754.30.5740.02260.258848.50.5110.02010.204789.40.440.01790.162479.60.4040.01590.12810.3610.01420.10210.320.01260.08040.2870.01130.06470.2540.01000.05070.2260.00890.04010.2030.00800.03160.180.00710.02550.160.00630.0201143128……

美日电容温度特性对照美……

PCB用基材词汇中英文对照PCB用基材词汇中英文对照1、基材：basematerial2、层压板：laminate3、覆金属箔基材：metal-cladbadematerial4、覆铜箔层压板：copper-cladlaminate(CCL)5、单面覆铜箔层压板：single-sidedcopper-cladlaminate6、双面覆铜箔层压板：double-sidedcopper-cladlaminate7、复合层压板：compositelaminate8、薄层压板：thinlaminate9、金属芯覆铜箔层压板：metalcorecopper-cladlaminate10、金属基覆铜层压板：metalbasecopper-cladlaminate11、挠性覆铜箔绝缘薄膜：flexiblecopper-claddielectricfilm12、基体材料：basismaterial13、预浸材料：prepreg14、粘结片：bondingsheet15、预浸粘结片：preimpregnatedbondingsheer16、环氧玻璃基板：epoxyglasssubstrate17、加成法用层压板：laminateforadditiveprocess18、预制内层覆箔板：masslaminationpanel19、内层芯板：corematerial20、催化板材：catalyzedboard,coatedcatalyzedlaminate21、涂胶催化层压板：adhesive-coatedcatalyzedlaminate22、涂胶无催层压板：adhesive-coateduncata……

贴片三极管上的印字与真实型号对照表p3'7$:83'7&783'7$783'7&:8306630666&*DOL0&6&1HF%$3KL%673KL05)/'7&&7*DOL0&%$7:6&1HF*DOL0&'7&7('7&78$'7&7.$%$7$6LH%$7:'7&7&$'7&7('7&78$'7&7.$05)/*DOL0&%%6LH6673$'*DOL0&'7&7('7&78$'7&7.$*DOL0&'7&7('7&78$'7&7.$'7&78$'7&7.$%&0RW6673$'05)/62505)/081':3'7$(8081':'7$(8$'7$(.$'7$(8$'7$(.$'7$(&$0$&6$081':%$75'7$(8$'7$(.$081':'7$(&$'7$(8$'7$(.$'7$(&$081':00%7081':'7$(8$'7$(.$%)377IN3'7&=.3'7$=.'7$(8$'7$(.$6673$'μ3KL3KL3KL3KL3KL3KL1HF$=&;,00RW5RK$=6LH&;$=5RK5RK5RK,6LH5RK5RK5RK5RK0RW$=,6LO$=5RK5RK5RK$=5RK5RK5RK5RK5RK16LO0RW6*60RW0RW3KL0RW5KR5KR5KR5KR5KR0$0RW6LH5RK5RK0RW5RK5RK5RK5……

LDO对照表,LDO对照表……