标签: 性焊

PBGA可靠性焊接影响因素THEEFFECTSOFSOLDERJOINTVOIDINGONPLASTICBALLGRIDARRAYRELIABILITYDonaldR.Banks,TerryE.Burnette,Yeuk-Chow(Dennis)Cho,WilliamT.DeMarco,andAndrewJ.MawerMotorolaSemiconductorProductsSectorAustin,Texas[1].Thisworkattemptstoaddressthequestionthroughdirectexperimentation.Voidsinsolderjointshavemanycauses.Eutecticsoldershrinksaboutfourpercentduringsolidification.Theinteriorofajointwouldbeexpectedtohaveavoidsimplybecauseitisthelastpartofthejointtosolidify.OutgassingoftheprintedcircuitboardorthePBGAsubstrateisanotherpossiblevoidsource.Moisture,incompletelaminatecuring,ormetallizationcontaminationcansupplygasesthatmaybeentrappedinasolderjoint[2].Fluxvolatilizationinsolderpasteorcr……