标签: Guidelines

IMCbasedRobustPIDdesign-Tuningguidelinesandautomatictuning

高通手机RFPCBLAYOUTGUIDELINES

高通手机RFPCBLAYOUTGUIDELINES

EMCDesignGuidelinesForElectronicModules

高通手机RFPCBLAYOUTGUIDELINES.pdf

ONSEMI_EMCTestsandPCBGuidelinesforAutomotiveLinearRegulators

GuidelinesforHandlingandProcessingMoistureSensitiveSurfaceMountDevices(SMDs)TMGuidelinesforHandlingandProcessingMoistureSensitiveSurfaceMountDevices(SMDs)TechnicalBriefOctober2000TB363.2Author:PatSelbyIntroductioninternalmoistureconcentrationreachesanequilibriumwiththeambientrelativehumidity.……

【应用笔记】AN592:CycloneIV设计指南(AN592:CycloneIVDesignGuidelines)本应用笔记提供了，在使用CycloneIV器件的设计中，一套易用的指南和一系列需要考虑因素。Thisapplicationnoteprovidesaneasy-to-usesetofguidelinesandalistoffactorstoconsiderinCyclone®IVdesigns.Alterarecommendsfollowingtheguidelineslistedinthisapplicationnotethroughoutthedesignprocess.Altera®CycloneIVdevicesofferarichcombinationoflogic,memory,anddigitalsignalprocessing(DSP)withthelowestpower.CycloneIVdevicesareideallysuitedforcost-sensitive,high-volumeapplications,includingdisplays,wirelessinfrastructureequipment,industrialEthernet,broadcastconverters,andchip-to-chipbridging.PlanningtheFPGAandsystemearlyinthedesignprocessiscrucialtoyoursuccess.AN592:CycloneIVDesignGuidelinesMarch2012AN-592-1.2Thisapplicationnoteprovidesaneasy-to-usesetofguidelinesandalistoffactorstoconsiderinCycloneIVdesigns.Alterarecommendsfollowingtheguidelineslistedinthisapplicationnotethroughoutthedesignprocess.AlteraCycloneIVdevicesofferarichcombinationoflogic,memory,anddigitalsignalprocessing(DSP)withthelowestpower.CycloneIVdevicesareideallysuitedforcost-sensitive,high-volumeappl……

【应用笔记】ArriaII器件设计指南(DesignGuidelinesforArriaIIDevices)本应用笔记提供了一套易用的指南和在使用ArriaII器件的设计中的一系列需要考虑因素。Thisapplicationnoteprovidesaneasy-to-usesetofguidelinesandalistoffactorstoconsiderinArria?IIdesigns.ItisimportanttofollowAlterarecommendationsthroughoutthedesignprocess.Altera?ArriaIIFPGAsaredesignedforease-of-use,lowcost,andlowpower,whilesupportingcommoninterfaceswithstreamlinedtransceiversandI/Os.PlanningtheFPGAandsystemearlyinthedesignprocessiscrucialtoyoursuccess.DesignGuidelinesforArriaIIDevicesAN-563-2.0ApplicationNoteThisapplicationnoteprovidesaneasy-to-usesetofguidelinesandalistoffactorstoconsiderinArriaIIdesigns.ItisimportanttofollowAlterarecommendationsthroughoutthedesignprocess.AlteraArriaIIFPGAsaredesignedforease-of-use,lowcost,andlowpower,whilesupportingcommoninterfaceswithstreamlinedtransceiversandI/Os.PlanningtheFPG……

Buried_Capacitance_Design_GuidelinesGUIDELINESFORBURIEDCAPACITANCEtmDESIGNSanmina-SCICorporationPCBDivisionThefollowingareRegisteredTrademarksofSanmina-SCI:BC???ThefollowingareTrademarksofSanmina-SCI:??????CreatedbytheSanmina-SCITechnologyEngineeringTeam.DocumentNumber:PWB-PED-xxxRevision:APrintedintheUnitedStatesofAmericahttp://www.sanmina-sci.comTheteamencouragesfeedbackaboutthisdocument.E-maildfm_guide@sanmina-sci.comwithsuggestions.Copyright2003Sanmina-SCICorporationAllrightsreserved.Nopartofthisdocumentthatiscoveredbycopyrightshereonmaybereproducedorusedinanyformorbyanymeans……

PCBdesignguidelinesforreducedEMIPCBDesignGuidelinesForReducedEMISZZA009November19991IMPORTANTNOTICETexasInstrumentsanditssubsidiaries(TI)reservetherighttomakechangestotheirproductsortodiscontinueanyproductorservicewithoutnotice,andadvisecustomerstoobtainthelatestversionofrelevantinformationtoverify,beforeplacingorders,thatinformationbeingreliedoniscurrentandcomplete.Allproductsaresoldsubjecttothetermsandconditionsofsalesuppliedatthetimeoforderacknowledgement,includingthosepertainingtowarranty,patentinfringement,andlimitationofliability.TIwarrantsperformanceofitssemiconductorproductstothespecificationsapplicableatthetimeofsaleinaccordancewithTI’sstandardwarranty.Testingandotherqualitycontroltechniques……

CV02-04-PCBDesignGuidelinesforEMI&ESDSuppressionCITRUSCOMCV02-04ESD+EMIFilterApplicationNotePCBDesignGuidelinesforEMI&ESDSuppressionPCBPlacementEMI&ESDPlacementConsiderationsGoodplacementinPCBdesignisveryimportantforsuppressionofEMI&ESDhazards.Ingeneral,ESDprotectiondevicesshouldbeplacedneartheI/Oconnectorsandtheprotectedlines.ThelengthofPCBmetaltracesconnectingESDdevices,ICsandI/OconnectorsisakeyfactorfortheESDprotectionofprotectedIConPCB.WhenasurgecurrentofESDstrikecomes,thepathimpedancedetermineshowmuchcurrentthepathwouldshuntincasethattheESDprotectiondevicesandon-chipprotectioncircuitshavethesametriggervoltage.Ashortertracelengthequatestosmallerimpedance,whichensuresmostthesurgeenergyshouldbedissipatedb……

PCBDesignGuidelinesforESDSuppressionSurgingIdeasTVSDiodeApplicationNotePROTECTIONPRODUCTSPCBDesignGuidelinesforESDSuppressionPrintedcircuitboard(PCB)layoutisacriticalcomponentforESDimmunity.InitialeffortinvestedinasoundPCBlayoutwillsavecostlydebuggingandrework.WhileTVSdiodesarerequiredtosuppresstheeffectsofdirectchargeinjectionthatresultsfromtheESDdischarge,PCBdesignmainlyimpactstheeffectsduetotheEMfieldsthataregeneratedbythedischargecurrent.ThisapplicationnotewillprovidePCBdesignguidelinesforoptimumESDimmunity.CircuitLoopsCurrentisinducedintoanyloopthatenclosesachangingmagneticflux.Themagnitudeofthecurrentwillbeproportionaltothesizeoftheloop.Largerloopsenclosemorefluxandthushighercurrentsareinduced……

EMIDesignGuidelinesforUSBComponentsEMIDesignGuidelinesforUSBComponents1.DisclaimerThisdocumentisprovided"asis"withnowarrantieswhatsoever,includinganywarrantyofmerchantability,fitnessforanyparticularpurpose,oranywarrantyotherwisearisingoutofproposal,specification,orsample.Nolicense,expressorimplied,byestoppelorotherwise,toanyotherintellectualpropertyrightsisgrantedherein.Inteldisclaimsallliability,includingliabilityforinfringementofanyproprietaryrights,relatingtoimplementationofinformationinthisdocument.2.IntroductionThesedevelopersnotesdescribeelectricalandmechanicalguidelinesforthedesignofEMCcompatibleUSBdevices.AdescriptionofEMItestproceduresisgiven,followedbyabriefreviewofthetheorybehindEMIphenomena.Designg……

TI_PCBDesignGuidelinesForReducedEMIPCBDesignGuidelinesForReducedEMISZZA009November19991IMPORTANTNOTICETexasInstrumentsanditssubsidiaries(TI)reservetherighttomakechangestotheirproductsortodiscontinueanyproductorservicewithoutnotice,andadvisecustomerstoobtainthelatestversionofrelevantinformationtoverify,beforeplacingorders,thatinformationbeingreliedoniscurrentandcomplete.Allproductsaresoldsubjecttothetermsandconditionsofsalesuppliedatthetimeoforderacknowledgement,includingthosepertainingtowarranty,patentinfringement,andlimitationofliability.TIwarrantsperformanceofitssemiconductorproductstothespecificationsapplicableatthetimeofsaleinaccordancewithTI’sstandardwarranty.Testingandotherqualitycontroltechniques……

SIMPLESWITCHERPCBLayoutGuidelinesSIMPLESWITCHERPCBLayoutGuidelinesSIMPLESWITCHERPCBLayoutGuidelinesIntroductionOneproblemwithwritinganApplicationNoteonPCBlayoutisthatthepeoplewhoreaditareusuallynottheoneswhoaregoingtouseit.Evenifthedesignerhasstruggledthroughelectromagneticfields,EMC,EMI,boardparasitics,transmissionlineeffects,grounding,etc.,hewillinallprobabilitythengoonwithhisprimarydesigntask,leavingthelayouttotheCAD/layoutperson.Unfortunately,especiallywhenitcomestoswitchingregulators,itisnotenoughtobeconcernedwithjustbasicrouting/connectivityandmechanicalissues.BoththedesignerandtheCADpersonneedtobeawarethatthedesignofaswitchingpowerconverterisonlyasgoodasitslayout.Whichprobablyexplainswhy……

guidelinesforMeasuringAudioPowerAmplifierPerformanceApplicationReportSLOA068……

layout_guidelines_for_mmic_componentsv01.0300LAYOUTGUIDELINESFORMMICCOMPONENTSAPPLICATIONNOTESIntroductionHittite’snewsurfacemountHMC121C8VoltageVariableAttenuator(VVA)andHMC220mixerinceramicandplasticpackagesarebeingusedinhigherfrequencyapplicationsforbothmilitaryandcommercialmarkets.AlongwithotherproductsfromHittite,theselowcostpackagescanrangeinfrequencyfromDCto15GHzforuseinmicrowaveradiosystems,VSAT,WLANandcellularcommunicationapplications.Inordertoachievethebenefitsofferedbythesedevices,particularattentionmustbepaidtothelayoutofthecircuitboardthatthedeviceisplacedon.OverviewAsnewapplicationsrequirehigherfrequency,designlayoutandmaterialsofthecircuitboardmustbethoroughlyexamined.Designissuessuchast……

BC2-ROMDesignGuidelines(bcore-ug-006Pa)……

RFCMOSICDesignGuidelinesCRAFTProjectCMOSRFCircuitDesignforWirelessApplicationESD-LPDEspritProject:25710RFCMOSICDesignGuidelinesEditor:JohnF.M.Gerrits,CSEMWithcontributionsfrom:DaniloGerna,STMicroelectronics,AlexandreGiry,FranceTélécomCNETDominiqueMorche,FranceTélécomCNETFrancescoSvelto,Universita'degliStudidiPaviaECTechnicalOfficer:MichaelHohenbichlerReference:CR.CSE.TN.001.01Date:7February2001SCOPE:Thegoalofthedesignguidelinesistogiveacondensedsummaryofgenerallyapplicablerecipesforsuccessfuldesignofmixed-modeRFandbasebandcircuits.MorespecificguidelinesforthedesignofCMOSLowNoiseAmplifiers,PowerAmplifiersandSigma-DeltaAnalog-to-Digitalconvertersareprovidedaswell.IntroductionThecontinuouslygrowingwire……