标签: mmic
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Packaginghasalwaysbeenthe“AchillesHeal”ofextract-ingthemaximummicrowaveperformanceoutofanyICtechnology.Theinherentparasiticcapacitanceandin-ductanceassociatedwithbondwires,leadframes,andencapsulatingdielectricmaterialsdominatethefnalproductshighfrequencyperformance.OnewaytosolvethisproblemistoeliminateparasiticcausingfactorsandmaketheICbecomethepackage.ThisisthebasisofWSP(WaferScalePackaging).GaAs-BasedSurfaceMountWaferScalePackageMMICsforDCto45GHzApplicationsWhitePaperBy:HenrikMorknerI.IntroductionPackaginghasalwaysbeenthe“AchillesHeal”ofextract-AvagoTechnologieshasbeenexperimentingwithWSPforingthemaximummicrowaveperformanceoutofanyICover10years.Itwasoriginallydevelopedtoprovidealowtechnology.Theinherentparasiticcapacitanceandin-costhermeticpackageforFBARMEMssilicontechnology.ductanceassociatedwithbondwires,leadframes,andLeveragingoffsiliconwaferbondingtechnology,theWSPencapsulatingdielectricmaterialsdominatethefinalsolutionwasappliedtoGaAsPHEMTICfab……
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官方资料-NecGaAsDeviceSelectionGuide2001GaAsDEVICESSELECTIONGUIDE2000/2001GaAsDEVICESSELECTIONGUIDE2000/2001[MEMO]2SelectionGuideP10747EJGV0SG00CAUTIONThegreatcaremustbetakenindealingwiththedevicesinthisguide.ThereasonisthatthematerialofthedevicesisGaAs(GalliumAresendie),whichisdesignatedasharmfulsubstanceaccordingtothelawconcerned.Keepthelawconcernedandsoon,especiallyincaseofremoval.TheinformationinthisdocumentiscurrentasofNovember,2000.Theinformationissubjecttochangewithoutnotice.Foractualdesign-in,refertothelatestpublicationsofNEC'sdatasheetsordatabooks,etc.,forthemost……
