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时间: 2019-12-24 18:43
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PackagingModules-PCBLandPatternDesignandSurfaceMountGuidelinesforPOLModulesTechnicalBrief488Authors:MarkKwokaandLoydeCarpenterPCBLandPatternDesignandSurfaceMountGuidelinesforPOLModulesIntroductionModuleQFNPackageOutlineIntersil'sPOLModuleProductfamilyofferingarelativelynewDrawingspackagingconceptthatiscurrentlyexperiencingrapidgrowth.Intersil’sindividualproductdatasheetsreferencetotheThisModuleProductfamilyfeaturestheQFNPackage.Thea……
标签: 封装模块
