Packaging Modules - PCB Land Pattern Design and Surface Mount Guidelines for POL Modules Technical Brief 488 Authors: Mark Kwoka and Loyde Carpenter PCB Land Pattern Design and Surface Mount Guidelines for POL Modules Introduction Module QFN Package Outline Intersil's POL Module Product family offering a relatively new Drawings packaging concept that is currently experiencing rapid growth. Intersil’s individual product data sheets reference to the This Module Product family features the QFN Package. The a……