标签: 3dmodule-draftfinal

3DModule-draftfinal3DIntegratedLTCCModuleusingBGAtechnologyforcompactC-bandRFFront-EndModuleS.Pinel,S.Chakraborty,S.Mandal,H.Liang,K.Lim,M.Roellig,R.Kunze,R.Tummala,M.TentzerisandJ.LaskarPackagingResearchcenter,YamacrawDesignCenter,SchoolofElectricalandComputerEngineeringGeorgiaInstituteofTechnology,AtlantaGA30332-0269USAFax:(404)894-5028,Email:pinel@ece.gatech.eduAbstract:Thispaperpresentsanovel3Dintegrationapproachforsystemonpackage(SOP)basedsolutionsforwirelesscommunicationapplications.Thisconcepthasbeenappliedforthe3DintegrationofaCbandWirelessLAN(WLAN)RFfront-endmodulebymeansofstackingLTCCsubstratesusingBGAtechnology.CharacterizationandmodelingofRFverticalboard-to-boardtransition,usingBGA……