3DModule-draftfinal3D Integrated LTCC Module using BGA technology for compact C-band RF Front-End Module S. Pinel, S. Chakraborty, S. Mandal, H. Liang, K. Lim, M. Roellig, R. Kunze, R. Tummala, M. Tentzeris and J. Laskar Packaging Research center, Yamacraw Design Center, School of Electrical and Computer Engineering Georgia Institute of Technology, Atlanta GA 30332-0269 USA Fax:(404) 894-5028, Email: pinel@ece.gatech.edu Abstract: This paper presents a novel 3D integration approach for system on package (SOP) based solutions for wireless communication applications. This concept has been applied for the 3D integration of a C band Wireless LAN (WLAN) RF front-end module by means of stacking LTCC substrates using BGA technology. Characterization and modeling of RF vertical board-to-board transition, using BGA……