标签: 装外

各种IC的封装外形打印文章页码，1/6打印本文关闭窗口各种IC封装形式作者：佚名文章来源：http://www.weierda.cn/icpacking.asp点击数：34823更新时间：2005-3-25文章录入：admin责任编辑：adminBGABallGridArrayEBGA680LLBGA160LPBGA217LPlasticBallGridArraySBGA192LTSBGA680LCLCCCNRCommunicationandNetworkingRiserSpecificationRevision1.2CPGACeramicPinGridArrayDIPDualInlinePackageDIP-tabDualInlinePackagewithMetalHeatsinkFBGAFDIPFTO-220FlatPackHSOP-28http://www.mcuchina.com/Article/Print.asp?ArticleID=4182006-5-23打印文章页码，2/6ITO-220ITO-3PJLCCLCCLDCCLGALQFPPCDIPPGAPlasticPinGridArrayPLCCPQFPPSDIPLQFP100LMETALQUAD100LPQFP100LQFPQuadFlatPackagehttp://www.mcuchina.com/Article/Print.asp?ArticleID=4182006-5-23打印文章页码，3/6SOT143SOT220SOT22……