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时间: 2019-12-24 18:54
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【应用笔记】为高速通道设计优化由表面贴装焊盘引起的阻抗不连续(OptimizingImpedanceDiscontinuityCausedbySurfaceMountPadsforHigh-SpeedChannelDesigns)由于数据传输速率不断增加,如今的高速板设计师对升级他们的设计来满足不断增张的带宽需求,面临巨大挑战。Asdataratescontinuetoincrease,today’shigh-speedboarddesignersfacetremendouschallengesupgradingtheirdesignstomeetincreasingbandwidthrequirements.Whenimplementinghigh-speeddesigns,anysmalldiscontinuitiesinthephysicalgeometriesalongthetransmissionpathcansignificantlydegradethesignal.Thisdegradationincludeslossofsignalamplitude,reductionofsignalrisetime,andincreasedjitter.Asaresult,youmustbeabletoidentifythesediscontinuitiesinthehigh-speedchannelandprovidewaystomitigatetheireffectsforbettersignaltransmission.OptimizingImpedanceDiscontinuityCausedbySurfaceMountPadsforHigh-SpeedChannelDesignsMay2008,version1.0ApplicationNote530IntroductionAsdataratescontinuetoincrease,today’shigh-speedboarddesignersfacetremendouschallengesupgradingtheirdesignstomeetincreasingbandwidthrequirements.Whenimplementinghigh-speeddesigns,anysmalldiscontinuitiesinthephysicalgeometriesalongthetransmissionpathcansignificantlydegradethesignal.Thisdegradationincludes……