原创 IPC-A-610E CIS 标准认证培训

1

概述/如何建立和保持认证课程政策和程序。(Summarize/policy and program)

关于认证课程、证书的期限、参与者的义务、IPC认证培训员、补考的政策等。(About authentication course\ Time limit of the certificate\ The participant's obligation etc.）

2

前言、可适用文件、操作(Foreword/ Applicable Documents/ Handling Electronic Assemblies)

范围、目的、特殊设计、术语和定义、图例、检查方法、尺寸界定、放大装置和照明、适用文件、IPC文件、电子组件操作等。Scope/ Purpose/ Specialized Designs/ Terms & Definitions/ Examples and Illustrations/ Inspection Methodology/ Verification of Dimensions / Magnification Aid and Lighting/ IPC Documents/ Handling Electronic Assemblies etc. )

3

机械装联(Hardware)

机械零件的安装、连接器、拔插件、手柄和插孔、连接器引脚、线束固定、布线等。(Hardware Installation/ Connectors、Handles、Extractors、Latches/Connector Pins/ Wire Bundle Securing/Routing etc.)

4

焊接和高电压(Soldering/ High Voltage)

焊接的可接受性、高电压以及焊接异常等(Soldering Acceptability Requirements/ Soldering Anomalies/ High Voltage)

5

接线柱的连接(Terminal Connections)

夹簧铆接端、铆接件、导线/引脚准备上锡、引脚成型-应力释放、维修环、应力释放引脚/导线弯曲、引脚/导线的安放、绝缘皮、导体、端子焊接、导体-损伤-焊后的情形等。(Edge Clip/ Swaged Hardware/ Wire/lead Preparation-tinning/Lead Forming-Stress Relief/Service loops/ Terminals-stress Relief lead/Wire Bend/ Lead/Wire Placement / Insulation/ Conductor/Terminals-Solder/ Conductor-Damage-Posit-Solder)

6

通孔连接技术(Through-hole Technology)

元气件安放、散热器、元气件紧固、支撑孔、非支撑孔、跨接线等。

(Component Mounting/ Heat-sinks/ Component Securing / Unsupported Holes / Supported

Holes / Jumper Wires.)

7

表面安装技术 (Surface Mount Assemblies)

胶水粘接、SMT连接（底部焊垫片式元件、1-3-5片式元件、圆拄型、城堡型、鸥翼型引脚、圆形或扁圆型引脚、J型、I型、扁平焊片、高立底部焊垫、内L型、BGA、PQFN等引脚形态）、跳线等。Staking Adhesive / SMT Connections( Chip Components-Bottom Only Terminations / Chip Components-Rectangular or Square End Components-1,3,5 Side Termination / Cylindrical End Cap(MELF) Termination / Castellated Terminations / Flat Ribbon, L, and Gull Wing Leads / Round or Flattened (coined) Leads / J leads / Butt/ I Connections / Flat Lug Leads / Tall Profile Components Having Bottom Only Terminations / Inward Formed L-Shaped Ribbon Leads / Surface Mount Area Array / Plastic Quad Flat Pack-No Leads(PQFN) / Components with Bottom Thermal Plane Terminations.) / Jumper Wires.

8

元件损伤和印制电路板及其组件(Component Damage / Printed Circuit Boards and Assemblies)

印制电路板和组件（金手指、层压板状况、导体和焊盘、标记、清洁度、涂覆）、元件的损伤等。Component Damage / Printed Circuit Boards and Assemblies(Gold Fingers / Laminate Conditions / Marking / Cleanliness / Coatings )

9

无焊绕接要求Discrete Wiring Acceptability Requirements

无焊绕接、匝数、匝间隙、导线尾端/带绝缘段绕匝、线匝隆起、联接位置、埋线、绕线松紧度、镀层、绝缘皮损伤、导线和接线柱损伤等的判定。

Solderless Wrap ( Number Wrap / Turn Spacing / End Tails, Insulation Wrap / Raised Tums Overlap / Connection Position / Wire Dress / Wire Slack / Wire Plating / Damaged Insulation / Damaged Conductors & Terminals)

10

610E版本增加内容

Add Content

术语、光照度、螺栓安装、锡料过量、探针型焊点、直角焊接连接器、板中板、BGA堆叠等等

Definitions, Lighting, Jackpost Mounting, Excess Solder, Probe Marks Solder Joints, Right Angle, Board in Board, BGA Package on Package etc.

11

考试Testing

开卷和闭卷Open testing and Close testing