原创 Qualcomm Bluetooth? Solutions

 2009-12-15 15:03  3074 4 4 分类: 通信

Qualcomm Bluetooth? Solutions Overview?

Qualcomm offers proven, world class Bluetooth? Hardware and Software solutions for mobile phones and other portable devices requiring low power consumption and a small form factor. The Bluetooth System on Chip (SoC) and integrated solutions support both Bluetooth 2.X + EDR (Enhanced Data Rate) and Bluetooth 3.0 + H.S. (High Speed), which is the latest version of the Bluetooth Specification. The SoC’s are available in several package options which allow for direct PCB attachment or for use in modules that include the Band-Pass Filter and other required external components. The integrated solutions combine Bluetooth with cellular radios, FM, Codec and touch screen controller and offer the smallest form factor available for handset platforms. Along with these SoC’s and integrated solutions, Qualcomm provides the complete Bluetooth Upper Layer Software Stack and Profiles.

Qualcomm's Bluetooth solutions facilitate wireless transfers of audio and data between Bluetooth enabled handsets, headsets, car-kits and other electronic devices.

Benefits

Complementary to other wireless technologies found on Qualcomm solutions, Bluetooth enables portable devices to connect and synchronize anywhere in the world. The possibilities for new products and services leveraging Qualcomm's Bluetooth solutions are unlimited.

Qualcomm Bluetooth solutions offer:

Cost-effective implementation of Bluetooth capabilities for handset and other portable device manufactures.
Enable slimmer form factors by reducing space requirements due to a small footprint and low external component count.
Minimal impact on battery life due to low active, standby and sleep power consumption requirements.
Turn-key solutions that have been fully integrated, tested and verified on Qualcomm platforms.
Bluetooth Special Interest Group Qualifications that manufacturer's can leverage thereby reducing their own Qualification testing requirements.
Fully verified reference designs that reduce OEM development time, engineering resource requirements and time to market risk.

Key Functionality

Qualcomm Bluetooth solutions provide:

Bluetooth 2.X + EDR and BT 3.0 + High Speed compliance
High speed UART (4 Mbps) interface to host for control and data
Support for all ACL, SCO and eSCO packet types
Piconet and Scatternet support
802.11 Coexistence via Packet Traffic Arbitration (PTA)
Direct conversion radio architecture reduces out of band emissions
Receiver sensitivity down to -91 dBm
Transmitter output up to +12dBm
Integrated regulators
Ball Grid Array, Bumped Die, Wafer Scale Package and integrated options

Bluetooth System on Chip Solutions

Product	Size	Bluetooth Specification
BTS 4020	4.5 x 4.5 - BGA	Bluetooth 2.0 + EDR
BTS 4020BD	3.2 x 3.2 - Bumped Die	Bluetooth 2.1 + EDR
BTS 4021	4.5 x 4.5 - BGA	Bluetooth 2.1+ EDR
BTS 4025	3.2 x 2.9 - WSP	Bluetooth 2.1 + EDR
QTR 8x00	Integrated Bluetooth	Bluetooth 3.0 + High Speed
QSC 6xx5	Integrated Bluetooth	Bluetooth 3.0 + High Speed

Bluetooth Profiles

Bluetooth Profile	Version
A2DP	1.0
AVRCP	1.0/1.3
BIP	1.0
BPP	1.0/1.2
DUN	1.1
FTP	1.1
GAVDP	1.0
GOEP	1.1
HFP	1.5
HSP	1.1
HID	1.0
OPP	1.1
PBAP	1.0
SAP	1.0
SDAP	1.1
SPP	1.1

高通公司推出新一代解决方案以改善蓝牙体验
更小、更节电的设计为手机制造商带来集成化和成本优势

领先的无线技术和数据解决方案的开发及创新厂商美国高通公司（Nasdaq：QCOM）今天宣布推出其蓝牙解决方案系列的新增技术，该技术将为手机制造商带来增强的用户体验和显著优势。蓝牙技术能够在手机耳机与其它基于蓝牙的终端间提供短距离无线连接。高通公司推出的新BTS4025?系统芯片（SoC）目前正授权能派科技出样，它将为最新的蓝牙2.1及增强数据速率（EDR）规格提供全面支持，比之前的蓝牙芯片具有更小巧的设计和更低的功耗，同时提供更优异的射频性能。BTS4025 SoC中的技术创新将带来更高的蓝牙性能，它可以更容易地应用于那些要求成本更低并且解决方案更为小巧的中低档手机。

“立足于我们第一代BTS4020蓝牙解决方案所创造的巨大市场动力，我们推出了又一款新型的蓝牙解决方案。”高通CDMA技术集团产品管理高级副总裁Mike Concannon表示： “作为业界最小并且功率更为高效的的蓝牙设备之一，BTS4025 SoC将在性能方面提高主流和入门级手机的标准。”

BTS4025 SoC小巧的3.2 x 2.9mm芯片封装远远小于任何同类解决方案。BTS4025 SoC几乎不需要任何外部组件，并且可以使用现有系统时钟，既节省空间又易于集成。在扫描其它蓝牙设备时，BTS4025 SoC可以将待机功耗最多减少50%，从而大大延长了电池寿命。此外，BTS4025 SoC可高效集成高性能的芯片自带功率放大器，最高可以发出+13 dBm的传输功率。提升的输出功率将增加蓝牙配对设备（例如，手机与耳机）间的连接可靠性和有效范围，从而改善最终用户体验。

高通公司的BTS4025 SoC解决方案针对与部分Mobile Station Modem? （MSM?）芯片组和Qualcomm Single Chip? （QSC?）解决方案接口进行了优化，提供了完整的蓝牙上层栈和配置文件的的集成而，为设备制造合作伙伴带来手机蓝牙的一站式解决方案。采用新芯片的首批手机将在今年晚些时候上市。

高通公司（www.Qualcomm.com）以其CDMA（码分多址）及其它先进数字技术为基础，开发并提供全球领先的富于创意的数字无线通信产品和服务。高通公司总部设在美国加利福尼亚州圣迭戈市，公司股票是标准普尔500指数的成分股，是2008年财富杂志评选的“财富500强”（FORTUNE 500?）之一，在纳斯达克股票市场（Nasdaq Stock Market?）上以QCOM的股票代码进行交易。

除了包含历史信息外，本新闻稿也包括前瞻性叙述内容，这些叙述具有一定的风险和不确定性，包括公司在适时及盈利的基础上成功地设计和大量生产CDMA组件的能力、CDMA的部署范围和速度、公司服务的各个市场经济状况的变化以及公司向美国证券交易委员会定期提交的报告中详列了其它风险和不确定性，

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