PCB及PCBA缺陷中英文对照表(二)
41漏印字符 | skip |
42金粗 | Au too big |
43金簿 | Au too thin |
44金手指缺口 | G/F voids/nick on G/F |
45金手指发黑 | G/F too black |
46字符印反 | inverse C/M |
47金手指针孔 | G/F pinholes |
48标志不清 | symbol unclear |
49标志错 | symbol wrong |
50绿油鬼影 | ghost in S/M |
51手指印 | finger print |
52补线不良 | poor line repairing |
53锡高 | exessive solder |
54孔小 | hole undersize |
55字符错 | wrong C/M |
56字符印偏 | C/M misalignment |
57字符入孔 | C/M in hole |
58字符 重影 | C/M doubloe image |
59漏镀金手指 | missing plating G/F |
60金手指发白 | G/F gray |
61焊盘脱落 | pad break off/pad peel off |
62焊盘露铜 | pad expose cu |
63断绿油桥 | missing S/M bridge |
64塞孔 | block hole |
65水迹 | water print |
66锡珠 | solder ball |
67砂孔 | pitting |
68油薄 | |
69聚油 | excess solder mask |
70锡粗 | Sn too thick |
71线路上锡 | Sn overlap scratch |
72绿 油 下 杂 物 | contamination under S/M |
73焊盘损坏 | land damage |
74焊盘翘起 | lifted land |
75偏位 | misregistration |
76漏钻孔 | missing hole |
77焊盘缺口 | nick on pad |
78线路缺口 | nick on track |
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