原创 PCB及PCBA缺陷中英文对照表(六)

 2010-1-12 21:39  5766 22 22 分类: 消费电子

PCB及PCBA缺陷中英文对照表(六)

1	粉红圈	Pink ring
2	焊盘崩缺	Broken annular ring
3	蚀刻不净	Under etching
4	焊盘脱落	Pad peel off
5	绿油上焊盘	S/M on pad
6	绿油图形移位	Pattern mis-registration
7	绿油露线	Expose trace
8	油薄	Uneven S/M thickness
9	入孔	S/M in hole
10	绿油冲板不良	S/M under develop
11	漏塞孔	S/M unplugged
12	IC栏不良	Poor IC barrier
13	绿油脱落	S/M peel off
14	塞孔不满	Incomplete S/M plugging
15	多开绿油窗	Extra opening
16	溶剂测试失败	Fail in solvent test
17	漏印	Skip printing
18	水印	Water mark
19	断绿油桥	S/M Bridge broken
20	绿油下氧化	Oxidation under soldermask
21	返工不良	Poor rework
22	错油	Wrong Ink
23	漏印字符	Missing legend ink
24	字符入孔	Legend in Hole
25	字符脱落	Legend peel off
26	字符上焊盘	Legend on pad
27	字符不清	Illegible legend
28	日期不清	Illegible date code
29	锣坑次品	Milling Defects
30	啤板方向错	Wrong punch direction
31	漏锣	Missing routing
32	漏斜切	Missing chamfering
33	斜边过度	Over chamfefing
34	错外形尺寸	Wrong outline dimension
35	倒边不良	Bevelling defect
36	金手指脱落	Gold finger peel off
37	露镍、铜	Ni/Cu exposure
38	缺口	Nick (G/F)
39	涂层不良	Poor ENTEK
40	锡上金手指	Solder on G/F
41	上锡不良	Dewetting
42	不上锡	Non wetting
43	锡珠、锡堆	Solder ball/lump
44	锡上线	Solder on trace
45	针痕	Pin mark
46	阻抗超出要求	Impedance out of requirement
47	工程试验	Evaluation
48	微切片（出货）	Microsection (outgoing)
49	微切片（工程试验用）	Microsection (engineering)