原创 Underfill Roadmap—By Namics

昨日拜读了中国电子胶水论坛上网友scotthsu提供的一份关于UNDERFILL的资料，是由日本NAMICS（纳美斯）公司整理撰写的（Mutual prosperity to both mankind and nature through Creativity, Innovation and Sensitivity），文中标明为”NAMICS CONFIDENTIAL”,不过既然能够从网络上得到，只怕也CONFIDENTIAL不到哪去，呵呵！全文对underfill做了一个全面的阐述，当然也对开发和检测underfill的一些方法以及发展方向做了综述，对整体了解underfill还是有一定帮助的，目录如下：
R&D Concept：
             A Wide Range of Accumulated Technologies
             In order to satisfy the Customers
             Various kinds of underfill materials
             Performances  promised by the top of market share
             Sufficient Analyzing facilities
Underfill Development:
             Understanding of packaging trends
             Underfill development concept
                     Low warpage&bump crack free
                     Narrow gap penetration
                     Bleeding free
             Products
             Roadmap

看完后个人整理如下： 阅读全文 ?