在Allegro中生成光绘文件的步骤:
1 选取菜单Manufacture/Artwork,打开Artwork Control Form对话框,如下图设置
2 设置Film Control项,在这里添加需要的层,该项具体参数含义如下:
Film Name:底片名称 Rotation:底片旋转的角度 Offset X,Y:底片偏移量
Undefined line width: 未定义的线宽 Shape bounding box: 默认值为100,
表示当Plot mode为负片时,由Shape的边缘往外需要画100mil的黑色区域
Plot mode: Positive 为正片,Negative为负片 Film mirrored: 底片是否左右反转
Full contact thermal-reliefs: 只有当为负片时,此项才被激活
Suppress unconnected pads: 是否画出未连线的Pad.只有当层为内层时,此项才被激活
Draw missing pad aperture:若勾选此项,表示当一个Padstack没有相应的Flash D-Code时,系统可以采用较小宽度的line D-Code涂满此Padstack
Use aperture rotation: Gerber数据能够使用镜头列表中的镜头来旋转定义的信息
Suppress shape fill: 勾选此项表示Shape的外形不画出,使用者必须加入分割线作为Shape的外形,只有在负片的时候,此项才被激活。
Available films: 在这里添加你需要的层,下面以4层板为例:
TOP层:board geometry/outline
manufacturing/photoplot_outline
etch/top
pin/top
via class/top
drawing format/title_data(加入注释文字,亦可根据习惯在其他层加入)
GND层:board geometry/outline
manufacturing/photoplot_outline
etch/gnd
pin/gnd
via class/gnd
Anti Etch/gnd
Anti Etch/all
drawing format/title_data
VCC层:board geometry/outline
manufacturing/photoplot_outline
etch/gnd
pin/gnd
via class/gnd
Anti Etch/vcc
Anti Etch/all
drawing format/title_data
BOTTOM层:board geometry/outline
manufacturing/photoplot_outline
etch/top
pin/top
via class/top
drawing format/title_data
SOLDERMASK_TOP层:board geometry/outline
manufacturing/photoplot_outline
via class/soldermask_top
pin/soldermask_top
package geometry/soldermask_top
board geometry/soldermask_top
drawing format/title_data
SOLDERMASK_BOTTOM层:board geometry/outline
manufacturing/photoplot_outline
via class/soldermask_bottom
pin/soldermask_bottom
package geometry/soldermask_bottom
board geometry/soldermask_bottom
drawing format/title_data
PASTEMASK_TOP层:board geometry/outline
pin/pastemask_top
drawing format/title_data
PASTEMASK_BOTTOM层:board geometry/outline
pin/pastemask_bottom
drawing format/title_data
SILK_TOP层: board geometry/outline
manufacturing/photoplot_outline
ref_des/silkscreen_top
package geometry/silkscreen_top
board geometry/silkscreen_top
drawing format/title_data
SILK_BOTTOM层:board geometry/outline
manufacturing/photoplot_outline
ref_des/silkscreen_bottom
package geometry/silkscreen_bottom
board geometry/silkscreen_bottom
drawing format/title_data
DRILL层:board geometry/outline
manufacturing/photoplot_outline
manufacturing/ncdrill_legend
manufacturing/ncdrill_figure
manufacturing/nclegend-1-2
board geometry/dimension
drawing format/title_data
PCB板厂所需文件,同样以4层板为例:4个参数文件,11个光绘文件,共15个文件,其中pastemask_top.art pastemask_bottom.art ,可以不用给到PCB板厂,因为此文件为钢网文件,只需给贴片开钢网时配合坐标文件使用。
nc_param.txt ncdrill.tap (ncdrill.drl) art_aper.txt art_param.txt
top.art gnd.art vcc.art bottom.art soldermask_top.art soldermask_bottom.art pastemask_top.art pastemask_bottom.art silkscreen_top.art silkscreen_bottom.art drill.art
注:双面板只需去掉gnd.art vcc.art ,多层板,只需再加上inner.art,多几层即加几层。
用户540066 2009-4-14 20:55
tengjingshu_112148725 2009-4-14 14:07