原创 ACS712ELC-30A 现货代理 柜台现货

• 
  
• 可通过新的滤波引脚设置器件带宽
  
• 5 μs 输出上升时间，对应步进输入电流
  
• 80 千赫带宽
  
• 总输出错误 1.5%（当 T_A= 25°C 时）及
  
• 小型低厚度 SOIC8 封装
  
• 1.2 mΩ 内部传导电阻
  
• 引脚 1-4 至 5-8 之间 2.1 V_RMS最小绝缘电压
  
• 5.0 伏特，单电源操作
  
• 66 至 185 mV/A 输出灵敏度
  
• 输出电压与交流或直流电流成比例
  
• 出厂时精确度校准
  
• 极稳定的输出偏置电压
  
• 近零的磁滞
  
• 电源电压的成比例输出

Description

The Allegro? ACS712 provides economical and precise solutions for AC or DC current sensing in industrial, commercial, and communications systems. The device package allows for easy implementation by the customer. Typical applications include motor control, load detection and management, switched-mode power supplies, and overcurrent fault protection. The device is not intended for automotive applications.

The device consists of a precise, low-offset, linear Hall sensor circuit with a copper conduction path located near the surface of the die. Applied current flowing through this copper conduction path generates a magnetic field which is sensed by the integrated Hall IC and converted into a proportional voltage. Device accuracy is optimized through the close proximity of the magnetic signal to the Hall transducer. A precise, proportional voltage is provided by the low-offset, chopper-stabilized BiCMOS Hall IC, which is programmed for accuracy after packaging.

The output of the device has a positive slope (>V_IOUT(Q)) when an increasing current flows through the primary copper conduction path (from pins 1 and 2, to pins 3 and 4), which is the path used for current sensing. The internal resistance of this conductive path is 1.2 mΩ typical, providing low power loss. The thickness of the copper conductor allows survival of the device at up to 5× overcurrent conditions. The terminals of the conductive path are electrically isolated from the sensor IC leads (pins 5 through 8). This allows the ACS712 current sensor IC to be used in applications requiring electrical isolation without the use of opto-isolators or other costly isolation techniques.

The ACS712 is provided in a small, surface mount SOIC8 package. The leadframe is plated with 100% matte tin, which is compatible with standard lead (Pb) free printed circuit board assembly processes. Internally, the device is Pb-free, except for flip-chip high-temperature Pb-based solder balls, currently exempt from RoHS. The device is fully calibrated prior to shipment from the factory.