| Over View |
Solderless compression type sockets are available for any chip size and grid pattern.
Easily mounted to the PCB with 4 through hole mounting pegs.
The assembly board ensures perfect coplanarity of the socket.
Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads.
Solderless compression type sockets are generally supplied with a screw lock retention system.
Custom versions available.
 Solderless/Compression Type BGA Socket Data Sheet
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MECHANICAL DATA |
Contact life: |
10,000 cycles min. |
Retention System life: |
10,000 cycles min. |
Solderability: |
exceeds MIL-STD-202 Method 208 |
Individual contact force: |
40 grams max. |
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| MATERIAL |
Insulator (RoHS Compliant): |
High temp plastic or epoxy FR4 |
Terminal (RoHS compliant): |
Brass |
Contact (RoHS compliant): |
BeCu |
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ELECTRICAL DATA |
Contact resistance: |
< 100 mΩ |
Current rating: |
500 mA max. |
Insulation resistance
at 500V DC: |
100 MΩ if 0.50 to 0.80mm pitch
500 MΩ 1.00mm pitch upwards |
Breakdown voltage
at 60 Hz: |
500V min. |
Capacitance: |
< 1 pF |
Inductance: |
< 2 nH |
Operating temperature: |
-55°C to +125°C ; 260°C for 60 sec. |
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精密半导体参数测试解决方案 直播时间： 01月08日 10:00
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