http://www.lingmei.com.cn/procenter-bga.htm
球形出脚的BGA插座系统主要适用于芯片的测试及开发等.该插座系统的特点是不用在PCB板上开孔,BGA插座的焊接方法和BGA芯片的焊接方法完全一样.同时如果在客户的目标板上BGA Pad旁边如果已经存在一些贴片器件而影响到BGA插座的安装,我们亦提供BGA插座的升高设计以便满足客户的实际要求.
| Over View |
Twist lock sockets are available for any chip size and grid pattern.
Available in SMT, thru-hole and solderless compression type versions.
Compact design.
Custom versions available on request.
 Twist-Lock Type BGA Socket Data Sheet
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MECHANICAL DATA |
Contact life: |
10,000 cycles min. |
Retention System life: |
1,000 cycles min. |
Solderability : |
Exceeds MIL-STD-202 Method 208 |
Individual contact force: |
40 grams max. |
Max. torque for retention
screws: |
up to 800 pins = 7cNm or 10 oz-inch
as of 800 pins = 7cNm to 10cNm or 10 oz to 14 oz-inch |
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| MATERIAL |
Insulator (RoHS Compliant): |
High temp plastic or epoxy FR4 |
Terminal (RoHS compliant): |
Brass |
Contact (RoHS compliant): |
BeCu |
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ELECTRICAL DATA |
Contact resistance: |
< 100 mΩ |
Current rating: |
500 mA max. |
Insulation resistance: |
at 500V DC 100 MΩ if 0.50 to 0.80mm pitch
500 MΩ 1.00mm pitch upwards |
Breakdown voltage: |
at 60 Hz 500V min. |
Capacitance: |
< 1 pF |
Inductance: |
< 2 nH |
Operating temperature: |
-55°C to +125°C ; 260°C for 60 sec. |
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