原创常用集成电路的封装形式

 2008-7-3 15:26  2871 11 11 分类: MCU/ 嵌入式

	BGA Ball Grid Array
	CLCC
	CPGA Ceramic Pin Grid Array
	DIP Dual Inline Package
	DIP-tab Dual Inline Package with Metal Heatsink
	FBGA
	<?XML:NAMESPACE PREFIX = O /> FDIP
	FTO220
	Flat Pack
	HSOP28
	ITO220
	ITO3p
	JLCC
	LCC
	LDCC
	LGA
	LQFP
	PCDIP
	PGA Plastic Pin Grid Array
	PLCC
	PQFP
	PSDIP
	LQFP 100L
	METAL QUAD 100L
	PQFP 100L
	QFP Quad Flat Package
	SOT220
	SOT223
	SOT223
	SOT23
	SOT23/SOT323
	SOT25/SOT353
	SOT26/SOT363
	SOT343
	SOT523
	SOT89
	SOT89
	LAMINATE TCSP 20L Chip Scale Package
	TO252
	TO263/TO268

	QFP Quad Flat Package
	TQFP 100L 详细规格
	SBGA
	SC-70 5L
	SDIP
	SIP Single Inline Package
	SO Small Outline Package

	SOJ 32L
	SOJ
	SOP EIAJ TYPE II 14L
	SOT220
	SSOP 16L
	SSOP
	TO18
	TO220
	TO247
	TO264
	TO3
	TO5
	TO52
	TO71
	TO72
	TO78
	TO8
	TO92
	TO93
	TO99
	TSOP Thin Small Outline Package
	TSSOP or TSOP II Thin Shrink Outline Package
	uBGA Micro Ball Grid Array
	uBGA Micro Ball Grid Array

	ZIP Zig-Zag Inline Package
TEPBGA 288L	TEPBGA 288L
	C-Bend Lead
	CERQUAD Ceramic Quad Flat Pack
	Ceramic Case
	LAMINATE CSP 112L Chip Scale Package
	Gull Wing Leads
	LLP 8La
	PDIP
	PLCC
	SNAPTK
	SNAPTK
	SNAPZP
	SOH