lga测试座-如何使用-有什么中文资料面包板社区

BGA/LGA/CGA/QFN/QFP高频测试插座产品分球形出脚(SMT)和针形出脚及接触式三种设计.球形出脚的BGA插座系统主要适用于芯片的测试及开发等.该插座系统的特点是不用在PCB板上开孔,BGA插座的焊接方法和BGA芯片的焊接方法完全一样.同时如果在客户的目标板上BGA Pad旁边如果已经存在一些贴片器件而影响到BGA插座的安装,亦提供BGA插座的升高设计以便满足客户的实际要求.并可根据客户的BGA器件出脚，定制合适的BGA插座( Available for any chip size and grid pattern )。产品特点: 适合任何封装之芯片 . 自感系数 : 小于 2nH 支持频率：正常不大于3G hz,特殊为 10G hz, 30 Ghz 适合任何芯片尺寸及球阵分布 . 超小尺寸设计出脚方式灵活：球型出脚, 针型出脚 , 接触式设计免焊接 . 弹簧针设计 , 避免对球体造成伤害 . 同时兼容BGA/LGA芯片测试 . 支持常温 , 老化 , 低频 , 高频测试 . 提供BGA插座的升高设计以便满足客户的实际要求 . 可加装散热器或风扇. ClamShell “Injection Molded” Type IC Development Sockets - Over View very easy open/close method ,no screws, no tools required SMT, thru hole or compression mount Bandwidths up to 3GHz (SMT) Bandwidths over 10GHz (compression mount) Integrated aluminum heatsink available Lid opening allows for failure analysis/probing Lid opening allows for optical IC development Low profile and mounts in IC's footprint (SMT mount) Pitches down to 0.5mm (SMT and thru hole mounts) or 0.4mm (compression mount) Any grid ClamShell Type BGA Socket Data Sheet MECHANICAL DATA Contact life: 10,000 cycles min. Solderability : as per IEC 60068-2-58 Individual contact force: 40 grams max. MATERIAL Insulator (RoHS Compliant): High temp plastic or epoxy FR4 Terminal (RoHS compliant): Brass Contact (RoHS compliant): BeCu ELECTRICAL DATA Contact resistance: 100 mΩ Current rating: 500 mA max. Insulation resistance: at 500V DC 100 MΩ if 0.50 to 0.80mm pitch 500 MΩ 1.00mm pitch upwards Breakdown voltage: at 60 Hz 500V min. Capacitance: 1 pF Inductance: 2 nH Operating temperature: -55°C to +125°C ; 260°C for 60 sec. 　 These sockets are available for almost any IC package style, size, lead-count and lead-pitch down to 0.5mm pitch: BGA, MLF/QFN, uBGA, SOIC, QFP and also custom packages or die. Furthermore, these sockets provide flexibility in the PCB mounting method: SMT, raised SMT, through-hole, or compression mount. SMT (pin type -30) uses a standard reflow process to mount the sockets to the target PCB. These sockets mount in the same footprint as the IC, but typically require a mimimum clearance of 6mm betyond the package's periphery. In situations where adjacent components lie in this area, either the socket body can be modified to clear the components, or a special raised SMT (pin types -28 or -29) pin can be used in place of the standard SMT pin. These pins raise the socket body from 2-5mm above the PCB. Although this method does not require any drilled holes in the target PCB, it is highly recommended to provide two such plated holes in order to accomodate mounting pegs and greatly strengthen the physical connection between the socket and PCB. Alternatively, epoxy can be used to strengthen the connection, but this more or less creates a permanent bond between the socket and PCB. Through-hole (pin type -70) requires plated holes to be drilled in the PCB into which the pins of the socket will be soldered. This provides for a very robust and reliable electrical and mechancial connection. However, the electrical performance is reduced due to the longer pin lengths. This method is highly suitable for burn-in applications. Compression (pin type -90) mount removes the need for any soldering and just requires the socket to be held to the PCB via screws. The benefit of this method is that it allows the customer to easily attach the socket to the target board in the lab, without the extra cost, lead-time, and potential problems caused by sending the board to an assembly house. However, this method requires that the target PCB has mounting holes drilled to accomodate the mounting screws and socket body alignment posts. Furthermore, depending on the size of the IC, the PCB thickness, etc., a backing plate is required to provide rigidity and ensure the socket pins contact the PCB pads. This plate can usually be modified to accomodate any backside compononents. SMT (-28, -29, -30) Through-Hole (-70) Compression (-90) SOCKET BODY VERTICAL OFFSET The following table shows the vertical clearance of the socket body from the PCB. This is only applicable to the SMT mounting style. In situations where the clearance is insufficient, or the standard SMT pin is preferred, it is possible to modify the socket body to accomodate for adjacent components. 　 Pitch Vertical Offset Using Special Raised SMT (-28) Vertical Offset Using Raised SMT (-29) Vertical Offset Using Standard SMT (-30) 0.50-0.75 N/A 2.3 0.4 0.8 4.5 2.8 0.6 1.00 4.5 3.2 0.8 1.27 N/A 5.0 1.2 Dimensions in mm FEATURES BENEFITS Easily exchange ICs in your system High bandwidth: 3GHz @ -1dB Available for any IC package style: BGA, uBGA, CSP, QFN/MLF, LGA, PGA, SOIC, QFP, custom or die Any lead count, grid and package size Minimum 0.5mm lead pitch Maximum 40g force per contact Mounts to same PCB footprint as the IC (no holes required for SMT version) Low profile: 10mm high with IC Minimal keepout area: approx. 6mm beyond ICs periphery Raised SMT version available for lifting socket over adjacent components Heat dissipation via lid cut-out or integrated heatsink Thermal expansion, shock vibration absorbed by contact design LGA contact design can also be used for board-to-board connections Standard-process design manufacturing = lower cost and tailored to your needs

标签: lga测试座