标签: 實裝

實裝技術,實裝技術……

無鉛實裝技術(零件篇)-富士通版1FujitsuLead-freePackageSemiconductorGroupLSIPackagingDivisionFujitsuLSIPACKAGINGDIVISIONAllRightsReserved,CopyrightFujitsuLimited2HistoryofFujitsuLead-freePackageDevelopmentActivitiesLead-freePackageDevelopmenttoCommenceCustomersApplicationTrendResearchLead-freeBGAMassProductionLead-freeQFPMassProduction[April1998Completed][Sept1998Completed][April2000Partiallystarted][Oct2000Partiallystarted]TargetForAllLSIProductsultimatelylead-free[Dec2002]FujitsuLSIPACKAGINGDIVISIONAllRightsReserved,CopyrightFujitsuLimited3Lead-freePackageDefinitionFujitsuLeadFreePackageSpecificationEcologicallyfriendlypackagewithleadbeingeliminatedfromitsterminal-usematerialandimprovedheatres……