無鉛實裝技術(零件篇)-富士通版1
Fujitsu Lead-free Package
Semiconductor Group LSI Packaging Division
Fujitsu LSI PACKAGING DIVISION
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Fujitsu Limited
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History of Fujitsu Lead-free Package Development Activities
Lead-free Package Development to Commence Customers Application Trend Research Lead-free BGA Mass Production Lead-free QFP Mass Production [ April 1998 Completed ] [ Sept 1998 Completed ] [ April 2000 Partially started ] [ Oct 2000 Partially started ]
Target For All LSI Products ultimately lead-free [ Dec 2002 ]
Fujitsu LSI PACKAGING DIVISION
All Rights Reserved, Copyright
Fujitsu Limited
3
Lead-free Package Definition
Fujitsu Lead Free Package Specification
Ecologically friendly package with lead being eliminated from its terminal-use material and improved heat res……
