标签: 無鉛

無鉛焊錫制程簡介,無鉛焊錫制程簡介……

無鉛制程61.PCB2.3.4.5.6.1.PCBPCB:a.(ElectrolyticNi/Au)b.OSP(OrganicSolderabilityPreservatives)c.(ImmersionAgd.(ElectrolessNi/Au,ENIG)e.(ImmersionTin)f.(SACHASL)a.b.OSPpaddipdipc.OSPd.HPDell!(BlackPad)HP2.SMT2603.a.SMTb.Dipc.Reworka.SMTSMT8Reflow8profile/sec!2/secreflow63/37b.Dip63/3730~40260-270!(270-280)c.Rework30~4030350~380420~450804.:a.b.c.a.(Sn96.5/Ag3.5,!!Sn/Pb221)b.(Sn99.3/Cu0.7227)NEMI,(270~280)Ni(0.1%)c.Sn/Ag3~4%/Cu0.5~1219)(1)NEMI----(Sn95.5/Ag3.9/Cu0.6)(2)JEIDA----(Sn96.5/Ag3.0/Cu0.5)(3)---(Sn96.5/Ag3.8/Cu0.7……

無鉛焊接的隱憂BGA121.2.3.SACClimbing4.Ni(0.07bywt)(T)mp3MobilityFluidity(Spreading)ReflowSC3T0.1bywt456123456i6132457i8910S/MS/MonPads11BGABGA2727mm3535mm10SubstrateLF”4.14.2TgBTPackagingAssembly78S/MonPad4“FR-412134.3DieAttachWireBondFlux4.4CTE4.5LFOSP14151617181234519“”――“”Weight%20――““”””――“2122“”123“4”“”23242556“”1……

無鉛實裝技術(零件篇)-富士通版1FujitsuLead-freePackageSemiconductorGroupLSIPackagingDivisionFujitsuLSIPACKAGINGDIVISIONAllRightsReserved,CopyrightFujitsuLimited2HistoryofFujitsuLead-freePackageDevelopmentActivitiesLead-freePackageDevelopmenttoCommenceCustomersApplicationTrendResearchLead-freeBGAMassProductionLead-freeQFPMassProduction[April1998Completed][Sept1998Completed][April2000Partiallystarted][Oct2000Partiallystarted]TargetForAllLSIProductsultimatelylead-free[Dec2002]FujitsuLSIPACKAGINGDIVISIONAllRightsReserved,CopyrightFujitsuLimited3Lead-freePackageDefinitionFujitsuLeadFreePackageSpecificationEcologicallyfriendlypackagewithleadbeingeliminatedfromitsterminal-usematerialandimprovedheatres……