無鉛焊接的隱憂 BGA 1 2 1. 2. 3. SAC Climbing 4. Ni(0.07 by wt) ( T) mp 3 Mobility Fluidity (Spreading) Reflow SC 3 T 0.1 by wt 4 5 6 1 2 3 4 5 6 i 6 1 3 2 4 5 7 i 8 9 10 S/M S/M on Pads 11 BGA BGA 27 27mm 35 35mm 10 Substrate LF ” 4.1 4.2 Tg BT Packaging Assembly 7 8 S/M on Pad 4 “ FR-4 12 13 4.3 Die Attach Wire Bond Flux 4.4 CTE 4.5 LF OSP 14 15 16 17 18 1 2 3 4 5 19 “ ” ―― “ ” Weight % 20 ―― “ “ ” ” ” ―― “ 21 22 “ ” 1 2 3 “ 4 ” “ ” 23 24 25 5 6 “ ” 1 ……