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时间: 2019-12-24 17:06
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摘要:两种常见的IC封装热阻的测量值是结到环境(的ThetaJA)和结点到外壳(西塔赛马)。这些参数计算最大功耗和自发热,和封装类型比较有用的。选择Maxim的温度传感器和1-Wire®器件的ThetaJA和Theta赛马值这里介绍。计算值的例子。Maxim>DesignSupport>TechnicalDocuments>ApplicationNotes>1-WireDevices>APP3930Maxim>DesignSupport>TechnicalDocuments>ApplicationNotes>GeneralEngineeringTopics>APP3930Maxim>DesignSupport>TechnicalDocuments>ApplicationNotes>MeasurementCircuits>APP3930Keywords:ThetaJA,ThetaJC,theta-ja,theta-jc,selfheating,thermaldissipation,heatdissipation,powerdissipation,thermalresistance,junctiontocase,junctiontoambient,temperature,sensor,temperaturesensor,thermalNov16,2006APPLICATIONNOTE3930PackageThermalResistanceValues(ThetaJA,ThetaJC)forTemperatureSensorsand1-W……