摘要：两种常见的IC封装热阻的测量值是结到环境（的Theta JA ）和结点到外壳（西塔赛马） 。这些参数计算最大功耗和自发热，和封装类型比较有用的。选择Maxim的温度传感器和1-Wire ®器件的Theta JA和Theta赛马值这里介绍。计算值的例子。Maxim > Design Support > Technical Documents > Application Notes > 1-Wire Devices > APP 3930 Maxim > Design Support > Technical Documents > Application Notes > General Engineering Topics > APP 3930 Maxim > Design Support > Technical Documents > Application Notes > Measurement Circuits > APP 3930 Keywords: Theta JA, Theta JC, theta-ja, theta-jc, self heating, thermal dissipation, heat dissipation, power dissipation, thermal resistance, junction to case, junction to ambient, temperature, sensor, temperature sensor, thermal Nov 16, 2006 APPLICATION NOTE 3930 Package Thermal Resistance Values (Theta JA, Theta JC) for Temperature Sensors and 1-W……