标签: chip-scale

本应用笔记提供使用（WLCSP）封装的指导。AN10439WaferLevelChipSizePackageRev.03―17October2007ApplicationnoteDocumentinformationInfoContentKeywordswafer,level,chip-scale,chip-size,package,WLCSPAbstractThisapplicationnoteprovidesguidelinesfortheuseofWaferLevelChipSizePackages(WLCSP).Forinformationonprintedcircuitboard(PCB),footprintdesignandreflowsolderingseeapplicationnoteAN10365(Surfacemountreflowsolderingdescription).NXPSemiconductorsAN10439……

Drivenbythetrendtosmaller,lighter,andthinnerconsumerproducts,smallerpackagetypeshavebeendeveloped.Indeed,packaginghasbecomeakeydeterminantforusingorabandoningadeviceinanewdesign.Thisarticlefirstdefinestheterms"flipchip"and"chip-scalepackage"andexplainsthetechnicaldevelopmentofwafer-levelpackaging(WLP)technology.Nextitdiscussespracticalaspectsofusingwafer-levelpackageddevices.Topicsinthatdiscussioninclude:determiningtheavailabilityofflip-chip/UCSP™packagingforagivendevice;identifyingaflipchip/UCSPbyitsmarking;thereliabilityofwafer-levelpackagedparts;andfindingapplicablereliabilityinformation.Thedocumentconcludeswithanoutlookonfuturepackagingdevelopments,referencestodocumentsusedinwritingthisapplicationnote,andlinkstoadditionalliteraturethataddressestopicsnotdiscussedhere.……