本应用笔记提供使用（WLCSP）封装的指导。 AN10439
Wafer Level Chip Size Package
Rev. 03 ― 17 October 2007 Application note
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Keywords wafer, level, chip-scale, chip-size, package, WLCSP
Abstract This application note provides guidelines for the use of Wafer Level Chip
Size Packages (WLCSP). For information on printed circuit board (PCB),
footprint design and reflow soldering see application note AN10365
(Surface mount reflow soldering description).
NXP Semiconductors AN10439
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