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标签: 表贴器件

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PCB的Land Pattern设计和QFN封装的表贴器件的指导

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时间: 2019-12-24 23:22

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上传者: wsu_w_hotmail.com

PCB的LandPattern设计和QFN封装的表贴器件的指导PCBLandPatternDesignandSurfaceMountGuidelinesforQFNPackagesTechnicalBriefApril23,2009TB389.6Authors:MarkKwokaandJimBensonIntroductionQFNPackageOutlineDrawingsIntersil'sQuadFlatNoLead(QFN)packagefamilyofferingIntersil’sindividualproductdatasheetsreferencetotheisarelativelynewpackagingconcept……
关于intersil的再PC板上焊接表贴器件的指导方针

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时间: 2019-12-24 18:43

大小: 15.5KB

上传者: 微风DS

ThemostcommonlyusedtechniquesformountingSMDs(SurfaceMountedDevices)toPCboardsareInfrared(IR)andVaporPhase(VP)reflow.IRandVPreflowarepreferredoverwavesoldering.Wavesolderingtypicallyinvolvesincreasedheatingrate,highertemperaturesandincreasedfluxexposure.Ifwavesolderingistobeusedasareflowmethod,Intersilmustbecontactedpriortouse.(SeeTechnicalBriefTB363,“GuidelinesforHandlingandProcessingMoistureSensitiveSurfaceMountDevices(SMDs)).TMGuidelinesforSolderingSurfaceMountComponentstoPCBoardsTechnicalBriefOctober2000TB334.2Author:MauryRoseneldIntroductionglasstransitiontemperatureoftheepoxyinFR-4boardsThemostcommonlyusedtechniquesformountingSMDs……

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