The most commonly used techniques for mounting SMDs (Surface Mounted Devices) to PC boards are Infrared (IR) and Vapor Phase (VP) reflow. IR and VP reflow are preferred over wave soldering. Wave soldering typically involves increased heating rate, higher temperatures and increased flux exposure. If wave soldering is to be used as a reflow method, Intersil must be contacted prior to use. (See Technical Brief TB363, “Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs)). TM Guidelines for Soldering Surface Mount Components to PC Boards Technical Brief October 2000 TB334.2 Author: Maury Roseneld Introduction glass transition temperature of the epoxy in FR-4 boards The most commonly used techniques for mounting SMDs ……