PCB的Land Pattern设计和QFN封装的表贴器件的指导 PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief April 23, 2009 TB389.6 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead (QFN) package family offering Intersil’s individual product data sheets reference to the is a relatively new packaging concept ……