标签: sod882d
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第一个无铅侧边焊封装SOD882DThefirstleadlesspackagewithsolderablesidepadsSolderable(Tin-plated)exposedsidepadsEasyvisibleinspectionofsolderpadsVeryhighmechanicalrobustness0.37mmPost-solderingstabilitymm0.61.0mminch:0402packageFullthermal,electrical,mountingandfootprintcompatibilitytoleadless1006mmpackages(inch:0402)Heightonly0.37mmBuiltforarangeoffunctionsProtection,SwitchingandSchottkydiodesIdealforsma……
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降低高度和创新焊盘设计NXPSOD882DpackagewithreducedheightandinnovativepaddesignFirstleadlesspackagewithtin-plated,solderablesidepadsThisnew,ultra-smallleadlessplasticpackageistheindustry’sfirsttooffersolderablesidepads.`Itmeasuresonly1.0x0.6x0.37mmanddeliversveryhighmechanicalstability.KeyfeaturesKeyapplications``Solderablesidepads``Highlyspace-constraineddevices``Lowpackageheightof0.37mm``Mobilephones``AEC-Q101qualified……
