降低高度和创新焊盘设计 NXP SOD882D package with reduced height and innovative pad design First leadless package with tin-plated, solderable side pads This new, ultra-small leadless plastic package is the industry’s first to offer solderable side pads. ` It measures only 1.0 x 0.6 x 0.37 mm and delivers very high mechanical stability. Key features Key applications `` Solderable side pads `` Highly space-constrained devices `` Low package height of 0.37 mm `` Mobile phones `` AEC-Q101 qualified ……