原创 标准Packages 封装数据手册

标准Packages 封装数据手册<?xml:namespace prefix = o ns = "urn:schemas-microsoft-com:office:office" />

封装分类

• 
  
• BGA (Ball Grid Array)
  
  
  • 
    
  • CBGA (Ceramic)
    
    
  • FCBGA
    
    
  • PBGA (Plastic)
    
    
  • SBGA (w/Heatsink)

  
  
• CSP (Chip Scale Package)
  
  
  • 
    
  • CSP BGA (Ball Grid Array)
    
    
  • LFCSP (LeadFrame)
    
    
  • LGA (Land Grid Array)
    
    
  • Tape CSP BGA
    
    
  • WLCSP (Wafer Level)

  
  
• DIP (Dual Inline Package)
  
  
  • 
    
  • CerDIP (Ceramic)
    
    
  • CerDIP - Gullwing Leads
    
    
  • CerDIP - Side or Bottom Brazed
    
    
  • Metal or Hybrid DIP
    
    
  • PDIP (Plastic)

  
  
• FlatPack
  
  
  • 
    
  • Ceramic Flat Package

  
  
• Header
  
  
  • 
    
  • Modules
    
    
  • TO-92 (Plastic Header)
    
    
  • TO-XX (Metal Header)

  
  
• LCC (Leaded or Leadless Chip Carrier)
  
  
  • 
    
  • CLCC - Gullwing Leads
    
    
  • J leaded CLCC
    
    
  • LCC (Leadless Ceramic)
    
    
  • PLCC (Plastic, Leaded)
    
    
  • PLCC w/heat sink

  
  
• PGA (Pin Grid Array)
  
  
  • 
    
  • Ceramic Pin Grid Array

  
  
• QFP (Quad Flat Pack)
  
  
  • 
    
  • CQFP (Ceramic)
    
    
  • LQFP 1.4mm thick
    
    
  • LQFP w/heat sink
    
    
  • MQFP
    
    
  • MQFP - Thermally Enhanced
    
    
  • TQFP (Thin, 1.0mm)
    
    
  • TQFP - Thermally Enhanced

  
  
• SIP (Single Inline Package)
  
  
  • 
    
  • SIP Vertical Leads
    
    
  • y-10(202)
    
    
  • y-10(204)
    
    
  • y-15
    
    
  • y-4
    
    
  • ys-5

  
  
• SOIC (Small Outline IC)
  
  
  • 
    
  • PSOP (SOIC w/heatslug)
    
    
  • SOIC (Narrow)
    
    
  • SOIC (Wide)

  
  
• SOP (Small Outline Package)
  
  
  • 
    
  • MSOP (micro-SOIC)
    
    
  • QSOP (25mil pitch)
    
    
  • SSOP (Shrink SO)
    
    
  • Thermally Enhanced [PSOP/2]
    
    
  • TSSOP (Thin, 1.2mm)
    
    
  • TSSOP_EP

  
  
• SOT (Small Outline Transistor)
  
  
  • 
    
  • SC-70
    
    
  • SOT-143
    
    
  • SOT-223
    
    
  • SOT-23
    
    
  • SOT-66
    
    
  • SOT-89
    
    
  • TSOT-23 (Thin, 0.9mm)

       以上数据都是ADI公司提供的，基本涵盖了芯片封装大小，如用Protel画封装的话，可以参考以上的数据手册，当然要注意的是，以上尺寸是芯片的大小，如果是机器焊接的话（回流焊/波峰焊），版图的大小可以按照芯片管脚的大小设计。如果是人焊接的话，为了方便焊接，焊盘还是画大一点好。

大家也可以参考Allegro封装生成器0.08里面封装尺寸。

Allegro封装生成器0.08下载：https://static.assets-stash.eet-china.com/album/old-resources/2009/3/13/761680b9-cae3-419a-a94d-843ea86be0c6.rar