14.6. SI 范例
上面部分讨论了SI 的定义,典型的SI 问题,它们的起因和重要性。对SI 分析包括概念,建模方法学和仿真工具等的相关背景知识做了介绍。在本章,将针对一个实际例子来使用仿真工具在设计流程中来分析SI 问题。
这是一个4 层PCB,堆栈为Signal/Power/Ground/Signal。一个DSP 芯片放置在PCB 板的中心,信号的边缘速率为500ps。在布线时,处于对串扰限制的考虑,相连线必须足够宽而不会产生过分的耦合噪声。样机制作完成以后,通过测量显示当驱动同时翻转的时候,时钟线上有比较大的耦合噪声。肉眼观察来看,时钟线网和信号线相距比较远,而且没有串扰的冲突被发现(图14-2 显示的是时钟线网的拓扑结构,信号和芯片的位置)。具体的后串扰仿真同时也显示时钟线和信号线之间的耦合是很小的。但是噪声是从哪里来的呢?
图14-12 PCB 上有问题的时钟网络
由于噪声总是在驱动瞬时开关输出(SSO)时产生的,所以对电源/地噪声进行了彻底的分析。利用Sigrity 公司出品的SI 工具-SPEED97 对PCB 内部的电磁场进行了求解。图14-13 表示的是电源和地平面之间的空间电压波形图(1.51ns时刻),14-4 表示的是波动的峰值图。从图中可以清楚的看出开关驱动源和板上去耦电容的位置。同时也注意到在图的上半部分有比较大的电源和地噪声,同时也是时钟过孔所在位置。至此,我们很清楚的知道是因为时钟的过孔耦合了电源噪声。14-15 图再一次说明了时钟过孔处的SSN 噪声。
图14-13 1.51ns 时电源和地之间空间噪声分布
图14-14. 10ns 仿真时间内电源和地平面电压峰值的空间分布图
图14-15 在过孔位置,时钟网络的瞬时开关噪声
压制耦合噪声的方法十分简单。通过在时钟过孔处添加一些附加的去耦电容,该点的电源/地噪声减小,从而在时钟线上所产生的耦合噪声也降低到了噪声要求的水平。去耦电容的正确值可以通过一系列的what-if 分析来仿真得到。修改以后的PCB 经过测量验证了仿真的结果。在进行仔细的SI 分析以后我们得到了一个成功的设计。
参考
[1] Tai-Yu Chou, “Signal Integrity Analysis in ASIC Design”, ASIC & EDA, pp.70-81, May 1994.
[2] Rob Kelley, “Choosing the Right Signal Integrity Tool”, Electronic Design, pp. 78-80, September 1995.
[3] Lisa Maliniak, “Signal Analysis: A Must For PCB Design Success”, Electronic Design, pp. 69-81, September 1995.
[4] Jin Zhao and Jiayuan Fang, “Significance of Electromagnetic Coupling Through Vias in Electronics Packaging”, IEEE 6th
Topical Meeting on Electrical Performance of Electronic Packaging, Conference Proceedings, p. 135-138, Oct., 1997.
[5] W. Becker, B. McCredie, G. Wilkins, and A. Iqbal, “Power Distribuiton Modeling of High Performance First Level Computer
Packages,” IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, Conference Proceedings, pp. 203-205,
Oct. 20-22, 1993, Monterey, CA., USA.
[6] M. Bedouani, “High Density Integrated Circuit Design: Simultaneous Switching Ground/Power Noises Calculation for Pin
Grid Array Packages,” 43rd Electronic Components & Technology Conference, Conference Proceedings, pp. 1039-1044, June
1-4, 1993, Orlando, FL., USA.
[7] R. Raghuram, D. Divekar, and P. Wang, “Efficient Computation of Ground Plane Inductances and Currents,” IEEE 2nd
Topical Meeting on Electrical Performance of Electronic Packaging, Conference Proceedings, pp. 131-134, Oct. 20-22, 1993,
Monterey, CA., USA.
[8] A.R. Djordjevic and T.K. Sarkar, “An Investigation of Delta-I Noise on Integrated Circuits,” IEEE Trans. Electromagn.
Compat., vol. 35, pp. 134-147, May 1993.
[9] Y. Chen, Z. Chen, Z. Wu, D. Xue, and J. Fang, “A New Approach to Signal Integrity Analysis of High-Speed Packaging,”
IEEE 4th Topical Meeting on Electrical Performance of Electronic Packaging, Conference Proc., pp. 235-238, Oct. 2-4, 1995,
Portland, Oregon.
[10] Y. Chen, Z. Wu, A. Agrawal, Y. Liu, and J. Fang, “Modeling of Delta-I Noise in Digital Electronics Packaging,” 1994 IEEE
Multi-Chip Module Conference, Conference Proc., pp. 126-131, Mar. 15-17,1994, Santa Cruz, CA.
[11] Y. Chen, Z. Chen, and J. Fang, “Optimum Placement of Decoupling Capacitors on Packages and Printed Circuit Boards
Under the Guidance of Electromagnetic Field Simulation,” 46th Electronic Components & Technology Conference, Conference
Proc., pp. 756-760, May 28-31, 1996, Orlando, Florida.
[12] Larry Smith, Raymond Anderson, Doug Forehand, Tom Pelc, and Tanmoy Roy, “Power Distribution System Design
Methodology and Capacitor Selection for Modern CMOS Technology”, IEEE Transactions on Advanced Packaging, pp. 284-291,
August, 1999.
[13] Dale Becker, “Tools and Techniques for Electromagnetic Modeling of Electronic Packages”, IEEE Topical Meeting on
Electrical Performance of Electronic Packaging, Short Course, October 1996.
[14] Andrew F. Peterson, “Computer-Aided Engineering Tools for Electronic Packaging Analysis”, IEEE Topical Meeting on
Electrical Performance of Electronic Packaging, Short Course, October 1996.
[15] W. Hobbs, A. Muranyi, R. Rosenbaum and D. Telian, Intel Corporation, “IBIS: I/O buffer Information Specification
Overview ”, http://www.vhdl.org, January 14, 1994.
[16] Peivand F. Tehrani, Yuzhe Chen, Jiayuan Fang, “Extraction of Transient Behavioral Model of Digital I/O Buffers from
IBIS”, IEEE Electronic Components & Technology Conference, Conference Proceedings, May 1996.
[17] Ying Wang and Han Ngee Tan, “The Development of Analog SPICE Behavioral Model Based on IBIS Model”, Proceedings
of the Ninth Great Lakes Symposium on VLSI, March, 1999.
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