职位说明: -Definition/generation of test concept and test specifications for digital and mixed signal communication IC’s. -Development of test hardware like load boards and probe cards. -Pattern conversion and test pattern generation. -Development of test program for wafer test, device test and characterization. -Optimization of test program and transfer of the test package to production site for wafer and final test. -Electrical Characterization for AC and DC parameters. -Test package documentation. -Test data analysis to ensuring stable yield, test coverage and optimized test time. -Develop innovative techniques for high parallelism and throughput.
职位要求: -Masters/Bachelor Degree in Electrical/Electronics Engineering. -Minimum of 3 years of experience in Test program Development for high-end digital ICs. -Proficient in high level programming languages “C”, “C++”, VB. -Experience on automatic test equipment like Agilent93K, Teradyne J750. -Familiarity with the mixed signal test development concepts and DSP based Testing. -Experience in DFT techniques will be an added advantage. -Good analytical and problem solving skills. -Knowledge of Unix Shell, Solaris OS, Windows OS and Perl. -A team player with an open and co-operative personality is desired.
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