原创 BGA测试插座系统

2007-11-13 11:14 1835 6 6 分类: 处理器与DSP

http://www.lingmei.com.cn/procenter-bga.htm


分球形出脚(SMT)和针形出脚两种设计.球形出脚的BGA插座系统主要适用于芯片的测试及开发等.该插座系统的特点是不用在PCB板上开孔,BGA插座的焊接方法和BGA芯片的焊接方法完全一样.同时如果在客户的目标板上BGA Pad旁边如果已经存在一些贴片器件而影响到BGA插座的安装,我们亦提供BGA插座的升高设计以便满足客户的实际要求.


产品特点:

iecool_arrow_051.gif Any package style: ceramic & plastic BGA, CSP, LGA, CGA, PSGA, MLF/QFN,QFP, SOIC, and other standard packages, custom packages or bare die
iecool_arrow_051.gif Inductance: less than 2nH

iecool_arrow_051.gif -1dB bandwidth: >14GHz for compression style; 3GHz for SMD style
iecool_arrow_051.gif  available for any chip size and grid pattern
iecool_arrow_051.gif Same PCB layout as the IC (no holes required for SMD socket)
iecool_arrow_051.gif Minimal keepout area of 6mm beyond the IC’s periphery
iecool_arrow_051.gif
Raised SMD style for lifting socket over adjacent components
iecool_arrow_051.gif Low profile socket (standard Twist Lock is less than 10mm high with IC)
iecool_arrow_051.gif Contact force: max 40 grams per contact; lower forces available

iecool_arrow_051.gif Semi-custom design = lower cost and tailored to your needs

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